|
|
| Line 12: |
Line 12: |
| *'''4'''. The masking material is dissolved, thus lifting part of the deposited material. | | *'''4'''. The masking material is dissolved, thus lifting part of the deposited material. |
| *'''5'''. The remaining material forms the desired pattern on the substrate. | | *'''5'''. The remaining material forms the desired pattern on the substrate. |
|
| |
| {| border="2" cellspacing="0" cellpadding="2"
| |
|
| |
| !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
| |
| |style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific Process Knowledge/Lithography/LiftOff#Lift-off |Lift-off]]</b>
| |
| |-
| |
| !style="background:silver; color:black;" align="center"|Purpose
| |
| |style="background:LightGrey; color:black"|
| |
| |style="background:WhiteSmoke; color:black"|
| |
| * AZ 5214E lift-off
| |
| * AZ nLOF lift-off
| |
| |-
| |
| !style="background:silver; color:black;" align="center"|Bath chemical
| |
| |style="background:LightGrey; color:black"|
| |
| |style="background:WhiteSmoke; color:black" align="center"|
| |
| NMP (Remover 1165) / Rinse in IPA
| |
| |-
| |
| !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
| |
| |style="background:LightGrey; color:black"|Process temperature
| |
| |style="background:WhiteSmoke; color:black" align="center"|
| |
| Heating of the bath is possible.
| |
|
| |
| The heating has been limited to 60°C
| |
| |-
| |
| |style="background:LightGrey; color:black"|Ultrasonic agitation
| |
| |style="background:WhiteSmoke; color:black" align="center"|
| |
| Continuous or pulsed
| |
|
| |
| The power may be varied
| |
| |-
| |
| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
| |
| |style="background:LightGrey; color:black"|Substrate size
| |
| |style="background:WhiteSmoke; color:black"|
| |
| * 100 mm wafers
| |
| * 150 mm wafers
| |
| |-
| |
| | style="background:LightGrey; color:black"|Allowed materials
| |
| |style="background:WhiteSmoke; color:black" align="center"|
| |
| Silicon or glass wafers
| |
|
| |
| Film or patterning of all but Type IV (Pb, Te)
| |
| |-
| |
| |style="background:LightGrey; color:black"|Batch
| |
| |style="background:WhiteSmoke; color:black" align="center"|
| |
| 1 - 25
| |
| |-
| |
| |}
| |
|
| |
|
| <br clear="all" /> | | <br clear="all" /> |