Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | ||
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific Process Knowledge/Lithography/LiftOff#Lift-off |Lift-off]]</b> | |style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific Process Knowledge/Lithography/LiftOff#Lift-off |Lift-off]]</b> | ||
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!style="background:silver; color:black;" align="center"|Purpose | !style="background:silver; color:black;" align="center"|Purpose | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* AZ 5214E lift-off | * AZ 5214E lift-off | ||
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|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
NMP (Remover 1165) / Rinse in IPA | |||
NMP (Remover 1165) | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters | ||
|style="background:LightGrey; color:black"|Process temperature | |style="background:LightGrey; color:black"|Process temperature | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Heating of the bath is possible. | Heating of the bath is possible. | ||
The heating has been limited to | The heating has been limited to 60°C | ||
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|style="background:LightGrey; color:black"|Ultrasonic agitation | |style="background:LightGrey; color:black"|Ultrasonic agitation | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Continuous or pulsed | Continuous or pulsed | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* 100 mm wafers | * 100 mm wafers | ||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
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Silicon or glass wafers | Silicon or glass wafers | ||
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|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
1 - 25 | 1 - 25 | ||
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