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Specific Process Knowledge/Thin film deposition/Sputter coater: Difference between revisions

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= The Sputter coater 03 (Cressington sputter coater) =
= The Sputter coater 03 (Cressington) =


[[image:Cressington_LA_1.jpg|300x300px|right|thumb|Sputter coater 03 (Cressington) located in the 346 basement, room 907]]
[[image:Cressington_LA_1.jpg|300x300px|right|thumb|Sputter coater 03 (Cressington) located in the 346 basement, room 907]]
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One of the most effective ways to counter problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The sputter coater allows you to coat small samples with a thin gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps, the gold layer will effectively eliminate all charging problems in the SEM.
One of the most effective ways to counter problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The sputter coater allows you to coat small samples with a thin gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps, the gold layer will effectively eliminate all charging problems in the SEM.
   
   
The sputter coater consists of a sputter chamber with a gold target and a stage. The stage consist of four smaller stages. These small stages can rotate individually in a planetary motion, when the entire stage rotates at the same time. The rotation speed is controlled by use of a black knob in front of the sputter chamber.Small samples can be mounted on a SEM pinstub holder (only use the smallest pinstubs) with carbon pad and then placed on one of the small stages. The maximum sample size is a 4 inch wafer. If your sample is larger than one of the four small stages, or if the sample is not fastened on a pinstub, the stage rotation should not be activated.   
The sputter coater consists of a sputter chamber with a gold target and a stage. The stage consist of four smaller stages. These small stages can rotate individually in a planetary motion, when the entire stage rotates at the same time. The rotation speed can be controlled. Small samples can be mounted on a SEM pinstub holder (only use the smallest pinstubs) with carbon pads and then placed on one of the small stages. The maximum sample size is a 4 inch wafer. If your sample is larger than one of the four small stages, or if the sample is not fastened on a pinstub, the stage rotation should not be activated.   
   
   
The machine is controlled by a control panel. The sputter process will be done automatically, but the sputter time can be adjusted.
The machine is controlled by a control panel. The sputter process will be done automatically, but the sputter time can be adjusted.
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The Balzer sputter coater is located in the 346 basement, room 907 (next to the SEM Supra 1) .  
The Balzer sputter coater is located in the 346 basement, room 907 (next to the SEM Supra 1) .  


'''The user manual and contact information can be found in LabManager:'''  
'''The user manual and contact information can be found in LabManager:'''  


[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=303  Sputter coater 03]
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=303  Sputter coater 03]


==Process knowledge==
==Process knowledge==


*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold|Deposition of gold]]
*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold|Deposition of gold]]


==Overview of the performance of the Sputter coater 03 (Cressington) and some process related parameters==
==Overview of the performance of the Sputter coater 03 (Cressington) and some process related parameters==