Specific Process Knowledge/Thin film deposition/Sputter coater: Difference between revisions
| Line 160: | Line 160: | ||
*Not measured | *Not measured | ||
|- | |- | ||
!style="background:silver; color:black" align="left" valign="top" rowspan=" | !style="background:silver; color:black" align="left" valign="top" rowspan="3"|Process parameter range | ||
|style="background:LightGrey; color:black"|Pressure||style="background:WhiteSmoke; color:black"| | |style="background:LightGrey; color:black"|Pressure||style="background:WhiteSmoke; color:black"| | ||
*0.01 mbar (default value) | *0.01 mbar (default value) | ||
| Line 167: | Line 167: | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*40 mA (default value) | *40 mA (default value) | ||
|- | |||
|style="background:LightGrey; color:black"|Sputter time | |||
|style="background:WhiteSmoke; color:black"| | |||
*Maximum 30 s | |||
|- | |- | ||
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Substrates | !style="background:silver; color:black" align="left" valign="top" rowspan="2"|Substrates | ||