Specific Process Knowledge/Thin film deposition/Sputter coater: Difference between revisions
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[[image:Cressington_LA_1.jpg|300x300px|right|thumb|Sputter coater 03 (Cressington) located in the 346 basement, room 907]] | [[image:Cressington_LA_1.jpg|300x300px|right|thumb|Sputter coater 03 (Cressington) located in the 346 basement, room 907]] | ||
The Sputter coater is used to sputter a thin gold layer on different small samples (smaller than 100 mm wafers). | The Sputter coater is used to sputter a thin gold layer on different small samples (smaller than 100 mm wafers). It is not allowed to use the sputter coater for other purposes. | ||
One of the most effective ways to counter problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The sputter coater allows you to coat small samples with a thin gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps, the gold layer will effectively eliminate all charging problems in the SEM. | One of the most effective ways to counter problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The sputter coater allows you to coat small samples with a thin gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps, the gold layer will effectively eliminate all charging problems in the SEM. | ||
The sputter coater consists of a sputter chamber with a gold target and a stage. The stage consist of four smaller stages. These small stages can rotate individually in a planetary motion, when the entire stage rotates at the same time. The rotation speed is controlled by use of a black knob in front of the sputter chamber.Small samples can be mounted on a SEM pinstub holder (only use the smallest pinstubs) with carbon pad and then placed on one of the small stages. The maximum sample size is a 4 inch wafer. If your sample is larger than one of the four small stages, or if the sample is not fastened on a pinstub, the stage rotation should not be activated. | |||
The machine is controlled by a control panel. The sputter process will be done automatically, but the sputter time can be adjusted. | |||
Please note that the sputter rate and uniformity have not been measured yet. | |||
Argon is used as a sputter gas to generate a plasma in the sputter chamber and to vent the chamber. | |||
The Balzer sputter coater is located in the 346 basement, room 907 (next to the SEM Supra 1) . | The Balzer sputter coater is located in the 346 basement, room 907 (next to the SEM Supra 1) . | ||
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*Not measured | *Not measured | ||
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!style="background:silver; color:black" align="left" valign="top" rowspan=" | !style="background:silver; color:black" align="left" valign="top" rowspan="3"|Process parameter range | ||
|style="background:LightGrey; color:black"|Pressure||style="background:WhiteSmoke; color:black"| | |style="background:LightGrey; color:black"|Pressure||style="background:WhiteSmoke; color:black"| | ||
*0.01 mbar | *0.01 mbar (default value) | ||
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|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Current | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *40 mA (default value) | ||
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates | !style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates | ||