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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,531 edits
Line 216: Line 216:
The 365nm exposure wavelength version is capable of 1.25 (1.0) um resolution in vacuum contact. All contact exposure programs (vacuum, low vacuum, hard, soft, proximity) are supplied.  
The 365nm exposure wavelength version is capable of 1.25 (1.0) um resolution in vacuum contact. All contact exposure programs (vacuum, low vacuum, hard, soft, proximity) are supplied.  
Two alignment options are available: top side alignment (TSA) with a split field or a video microscope and back side alignment (BSA) with BSA (video) microscope.
Two alignment options are available: top side alignment (TSA) with a split field or a video microscope and back side alignment (BSA) with BSA (video) microscope.
The aligner can also be used for bond alignment (for Wafer Bonder 02). Special training is required.


'''Training videos: [http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.053_Aligner_MA6_part1_operation-720p.mp4 Operation] [http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.053_Aligner_MA6_part2_aligning-720p.mp4 Alignment]'''
'''Training videos: [http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.053_Aligner_MA6_part1_operation-720p.mp4 Operation] [http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.053_Aligner_MA6_part2_aligning-720p.mp4 Alignment]'''
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