Specific Process Knowledge/Etch/Etching of Silicon Oxide: Difference between revisions
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*[[Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch]] | *[[Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch]] | ||
*[[/SiO2 etch using RIE1 or RIE2|SiO2 etch using RIE2]] | *[[/SiO2 etch using RIE1 or RIE2|SiO2 etch using RIE2]] | ||
*[[/SiO2 etch using ASE|SiO2 etch using ASE]] | |||
*[[Specific_Process_Knowledge/Etch/III-V_RIE/III_V_RIE_ETCHES#CHF3.2FO2_etch |SiO2 etch using III-V RIE]] | *[[Specific_Process_Knowledge/Etch/III-V_RIE/III_V_RIE_ETCHES#CHF3.2FO2_etch |SiO2 etch using III-V RIE]] | ||
*[[/SiO2 etch using AOE|SiO2 etch using AOE]] | *[[/SiO2 etch using AOE|SiO2 etch using AOE]] | ||