Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

@@ Line 235: / Line 235: @@
 |style="background:LightGrey; color:black"|
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-Alignment and UV exposure, potentially DUV exposure
+Mask alignment and UV exposure, potentially DUV exposure <sup>1)</sup>
+Bond alignment
 |-
@@ Line 252: / Line 254: @@
 |style="background:LightGrey; color:black"|Minimum structure size
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-down to 0.8 µm <sup>1)</sup>
+Typically 1.25 µm, possibly down to 0.8 µm <sup>1)</sup>
 |-
 |style="background:LightGrey; color:black"|Mask size