Specific Process Knowledge/Pattern Design: Difference between revisions
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=== Layout file format=== | === Layout file format=== | ||
* For '''E-beam lithography''' the layout file has to prepared as a GDS file, which is then uses for the preparation of a set of files (V30, | * For '''E-beam lithography''' the layout file has to prepared as a GDS file, which is then uses for the preparation of a set of files (V30, sdf, jdf and mgn files). For details about how to prepare the files for E-beam, please see [[Specific_Process_Knowledge/Lithography/EBeamLithography/FilePreparation#FilePreparation|File preparation]]. For details about how to make alligned E-beam patterns, please have at look at [[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#Design_of_global_marks_and_chip_marks|Design of global marks and chip marks]] | ||
* For '''laser cutting''' the layout file has to be saved as a DXF file that is uploaded to the equipment computer. For more details concerning pattern design for the laser see [[Specific_Process_Knowledge/Back-end_processing/Mask_making|Mask Making on the Laser Micro Machining Tool]]. | * For '''laser cutting''' the layout file has to be saved as a DXF file that is uploaded to the equipment computer. For more details concerning pattern design for the laser see [[Specific_Process_Knowledge/Back-end_processing/Mask_making|Mask Making on the Laser Micro Machining Tool]]. | ||