Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | |||
|style="background:WhiteSmoke; color:black"|<b>Electroplating-Ni</b> | |||
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!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
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Electrochemical deposition of nickel | |||
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Parameter | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Parameter | ||
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | |||
|style="background:WhiteSmoke; color:black"|<b>Electroplating-Ni</b> | |||
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!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
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Electrochemical deposition of nickel | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | |||
|style="background:LightGrey; color:black"|Thickness | |||
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0 - 1400 µm | |||
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|style="background:LightGrey; color:black"|Uniformity | |||
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Around 10% (depending on sample and process) | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | |||
|style="background:LightGrey; color:black"|Temperature | |||
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52*C | |||
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|style="background:LightGrey; color:black"|pH | |||
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3,5 - 4,0 (3,5 - 3,8 recommended by manufacturer) | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Batch size | |||
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*<nowiki>#</nowiki> 1 x 50 mm wafer | |||
*<nowiki>#</nowiki> 1 x 100 mm wafer | |||
*<nowiki>#</nowiki> 1 x 150 mm wafer | |||
*Maximum sample thickness: 1,0 mm | |||
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| style="background:LightGrey; color:black"|Allowed materials | |||
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*Most materials '''except copper and cobalt'''. | |||
*Ask Danchip for details. | |||
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