Specific Process Knowledge/Lithography/Development: Difference between revisions
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!style="background:silver; color:black" align="center" valign="center" rowspan=" | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Method | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Development | ||
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Submersion | Submersion | ||
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Puddle | Puddle | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan=" | |style="background:LightGrey; color:black"|Handling | ||
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Cassette | |||
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Cassette | |||
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Single wafer holder | |||
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Edge handling chuck or chip "basket" | |||
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Vacuum chuck | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters | |||
|style="background:LightGrey; color:black"|Temperature | |style="background:LightGrey; color:black"|Temperature | ||
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Room temperature | Room temperature | ||
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|style="background:LightGrey; color:black"|Agitation | |style="background:LightGrey; color:black"|Agitation | ||