Specific Process Knowledge/Lithography/Development: Difference between revisions

@@ Line 80: / Line 80: @@
 Puddle
 |-
-!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
+!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameters
 |style="background:LightGrey; color:black"|Temperature
 |style="background:WhiteSmoke; color:black" align="center"|
@@ Line 92: / Line 92: @@
 |style="background:WhiteSmoke; color:black" align="center"|
 Room temperature
+|-
+|style="background:LightGrey; color:black"|Handling
+|style="background:WhiteSmoke; color:black" align="center"|
+Cassette
+|style="background:WhiteSmoke; color:black" align="center"|
+Cassette
+|style="background:WhiteSmoke; color:black" align="center"|
+Single wafer holder
+|style="background:WhiteSmoke; color:black" align="center"|
+Edge handling chuck or chip "basket"
+|style="background:WhiteSmoke; color:black" align="center"|
+Vacuum chuck
 |-
 |style="background:LightGrey; color:black"|Agitation
@@ Line 101: / Line 113: @@
 Magnetic stirrer
 |style="background:WhiteSmoke; color:black" align="center"|
-none
+Rotation
 |style="background:WhiteSmoke; color:black" align="center"|
 Rotation
@@ Line 128: / Line 140: @@
 * 100 mm wafers
 |style="background:WhiteSmoke; color:black" align="center"|
+* Chips (5mm to 2")
 * 100 mm wafers
 * 150 mm wafers