Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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 |style="background:LightGrey; color:black"|Exposure mode
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-soft contact, hard contact, proximity, flood exposure
+vacuum contact, hard contact, soft contact, proximity, flood exposure
 |-
 | style="background:LightGrey; color:black"|Exposure light/filters
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-nm, 405 nm
+*broadband (i-, g-, h-line)
+*365 nm (i-line)
+*DUV (240 nm)
 |-
 |style="background:LightGrey; color:black"|Minimum structure size
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-down to 2µm
+down to 0.5µm
 |-
 |style="background:LightGrey; color:black"|Mask size
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-*3x3inch
+*5x5inch
-*5x5inch (with adapter)
+*7x7inch
 |-
 |style="background:LightGrey; color:black"|Alignment modes
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-Top side only
+*Top side (TSA)
+*Backside (BSA)
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Substrate size
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+* small pieces 1x1cm
 * 50 mm wafers
-* small pieces 1x1cm
+* 100 mm wafers
+* 150 mm wafers
 |-
 | style="background:LightGrey; color:black"|Allowed materials
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-III-V materials
+??
 |-
 |style="background:LightGrey; color:black"|Batch