Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions

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 ==AZ nLOF 2020==
+[[Image:RCD8 AZ 4562.jpg|300x300px|thumb|right|Spin curve for AZ 4562]]
+Spin coating of AZ 4562 on Spin Coater: RCD8 using manual dispense is a very simple process. The wafer is accelerated at 1000rpm/s to the spin-off speed, spun for 30s, then decelerated at 1000rpm/s.
+''Recipe names, process parameters, and test results:''
+*'''1 DCH 4562 man disp 10um'''
+Spin-off: 30 s at 2000 rpm.
+{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;"
+|-
+|-style="background:silver; color:black"
+!Substrate
+!Thickness
+!Uniformity (+/-)
+!Test date
+!Tester initials
+!Comments
+|-
+|-style="background:WhiteSmoke; color:black"
+|Silicon with native oxide
+|9.92 µm
+|2.9%
+|29/4 2015
+|taran
+|9 points on one wafer, exclusion zone 5mm
+|}
+<br clear="all" />
 =Template recipes=