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Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,579 edits
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*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processC|Process C (Nano etch): 50-300 nm posts]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processC|Process C (Nano etch): 50-300 nm posts]]


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processD|Process D (Micro stamp): ]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processD|Process D (Micro stamp) ''Please note that this process has changed'' ]]


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/SOIetch|SOI etch]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/SOIetch|SOI etch]]
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