Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy/Workspaces

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Roughness measurements High aspect ratio samples Steep steps - but no high aspect ratio Topographic measurement with no or very small steps (<?)

Comparison method 1 and method 2 for the process

	Roughness measurements	Topographic measurements with no steep steps	Steep steps but no high aspect ratio	High aspect ratio measurements
Generel description	Generel description - Roughness measurements	Generel description -
Recommended probes	A B	A B
Recommended experiment/Workspace	A B C	A
Substrate size	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers
Allowed materials	Allowed material 1 Allowed material 2	Allowed material 1 Allowed material 2 Allowed material 3