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| Line 198: |
Line 198: |
| The Aligner-6inch has a long pass filter designed for SU-8 exposure installed. The SU-8 filter has no transmission in the 250-330nm range, and close to full transmission in the 400-500nm range. In the 350-370nm range, the transmission is approximately 0.5. This results in a broadband exposure light consisting of the i-line (365nm), the h-line (405nm), and the g-line (435nm) from the Hg spectrum. Dependent on the spectral sensitivity of the resist, the optimal dose may be decreased compared to i-line exposure on the KS-Aligner. | | The Aligner-6inch has a long pass filter designed for SU-8 exposure installed. The SU-8 filter has no transmission in the 250-330nm range, and close to full transmission in the 400-500nm range. In the 350-370nm range, the transmission is approximately 0.5. This results in a broadband exposure light consisting of the i-line (365nm), the h-line (405nm), and the g-line (435nm) from the Hg spectrum. Dependent on the spectral sensitivity of the resist, the optimal dose may be decreased compared to i-line exposure on the KS-Aligner. |
|
| |
|
| '''Positive tone resists:'''
| | *[[Specific Process Knowledge/Lithography/UVExposure/UVExposure dose|Information on UV exposure dose]] |
| | |
| '''AZ 5214E and AZ 4562'''
| |
| | |
| Compared to exposure on KS-Aligner, the dose on Aligner-6inch is halved.
| |
| *1.5µm: 24.5 mJ/cm<sup>2</sup> corresponding to 3.5 seconds exposure at 7 mW/cm<sup>2</sup>. | |
| *10µm: ~140 mJ/cm<sup>2</sup> corresponding to ~20 seconds exposure at 7 mW/cm<sup>2</sup>. Multiple exposure with 10s pauses is recommended.
| |
| | |
| '''AZ MiR 701''' ''Preliminary results''
| |
| | |
| Compared to exposure on KS-Aligner, the dose on Aligner-6inch is one fifth.
| |
| *1.5µm: 31.5 mJ/cm<sup>2</sup> corresponding to 4.5 seconds exposure at 7 mW/cm<sup>2</sup>.
| |
| | |
| '''Negative tone resists'''
| |
| | |
| '''AZ 5214E image reversal'''
| |
| | |
| Compared to exposure on KS-Aligner, the dose on Aligner-6inch is halved.
| |
| *1.5µm: 10.5 mJ/cm<sup>2</sup> corresponding to 1.5 seconds exposure at 7 mW/cm<sup>2</sup>.
| |
| *2.2µm: 12 mJ/cm<sup>2</sup> corresponding to 1.7 seconds exposure at 7 mW/cm<sup>2</sup>.
| |
| | |
| Flood exposure after reversal bake: 105 mJ/cm<sup>2</sup> corresponding to 15 seconds exposure at 7 mW/cm<sup>2</sup>.
| |
| | |
| '''AZ nLOF 20XX''' ''Preliminary results''
| |
| | |
| Compared to exposure on KS-Aligner, the dose on Aligner-6inch is the same.
| |
| *1.5µm: 42 mJ/cm<sup>2</sup> corresponding to 6 seconds exposure at 7 mW/cm<sup>2</sup>.
| |
| *2µm: 49 mJ/cm<sup>2</sup> corresponding to 7 seconds exposure at 7 mW/cm<sup>2</sup>.
| |
| *3µm: 56 mJ/cm<sup>2</sup> corresponding to 8 seconds exposure at 7 mW/cm<sup>2</sup>.
| |
| *4.3µm: 70 mJ/cm<sup>2</sup> corresponding to 10 seconds exposure at 7 mW/cm<sup>2</sup>.
| |
| | |
| <br clear="all" />
| |
| | |
| === Equipment performance and process related parameters ===
| |
| | |
| {| border="2" cellspacing="0" cellpadding="2"
| |
| | |
| !style="background:silver; color:black;" align="center" width="60"|Purpose
| |
| |style="background:LightGrey; color:black"|
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| Alignment and UV exposure
| |
| |-
| |
| | |
| !style="background:silver; color:black" align="left" valign="center" rowspan="5"|Performance
| |
| | |
| |style="background:LightGrey; color:black"|Exposure mode
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| *soft contact, hard contact, proximity, flood exposure
| |
| *automatic loading optional for 6inch substrates
| |
| *automatic pattern recognition optional for special alignment marks
| |
| |-
| |
| | style="background:LightGrey; color:black"|Exposure light/filters
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| *SU8 filter (long-pass), light intensity 7mW/cm2 in Constant Power (CP) mode
| |
| *365 nm filter optional
| |
| |-
| |
| |style="background:LightGrey; color:black"|Minimum structure size
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| *down to 1um exposure with 4inch chuck
| |
| *down to 5um exposure with 6inch chuck
| |
| |-
| |
| |style="background:LightGrey; color:black"|Mask size
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| *5x5inch
| |
| *7x7inch
| |
| |-
| |
| |style="background:LightGrey; color:black"|Alignment modes
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| *Top Side Alignment(TSA)
| |
| *Bottom Side Alignment(BSA)
| |
| | |
| |-
| |
| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
| |
| |style="background:LightGrey; color:black"|Substrate size
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| * 50 mm wafers
| |
| * 110 mm wafers
| |
| * 150 mm wafers
| |
| | |
| |-
| |
| | style="background:LightGrey; color:black"|Allowed materials
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| All cleanroom materials except III-V materials
| |
| | |
| |-
| |
| |style="background:LightGrey; color:black"|Batch
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| *1 for 4inch substrates
| |
| *25 for 6inch substrates in automatic loading mode
| |
| |-
| |
| |}
| |
|
| |
|
| <br clear="all" /> | | <br clear="all" /> |
