Specific Process Knowledge/Thin film deposition/ALD Picosun R200: Difference between revisions
No edit summary |
|||
| Line 37: | Line 37: | ||
*[[Specific Process Knowledge/Thin Film deposition/ALD/Results from the ALD acceptance test|Results from the ALD acceptance test]] | *[[Specific Process Knowledge/Thin Film deposition/ALD/Results from the ALD acceptance test|Results from the ALD acceptance test]] | ||
*[[Specific Process Knowledge/Thin Film deposition/ALD/Al2O3 deposition using ALD|Al<sub>2</sub>O<sub>3</sub> deposition using ALD]] | *[[Specific Process Knowledge/Thin Film deposition/ALD/Al2O3 deposition using ALD|Al<sub>2</sub>O<sub>3</sub> deposition using ALD]] | ||
*[[Specific Process Knowledge/Thin Film deposition/ALD/ | *[[Specific Process Knowledge/Thin Film deposition/ALD/TiO2 deposition using ALD|TiO<sub>2</sub> deposition using ALD]] | ||
==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||