Specific Process Knowledge: Difference between revisions
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Revision as of 08:15, 12 June 2014
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Overview of sample processing
Clean the sample |
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Drying Samples |
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Thermal treatment of the sample |
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Make a mask on the sample |
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Lithography |
Imprinting |
Transfer pattern into the sample |
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Wet etch |
Dry etch |
Lift-off |
Direct structure definition |
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Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding samples together |
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Characterize the sample |
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Back end of the sample |
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Chip/die mounting |
Wire bonding |
Dicing |
Overview of sample processing 2
Thermal Oxide growth | |
Thin Film deposition | |
Sputter deposition | |
Thermal deposition | |
E-beam evaporation | |
CVD | |
LPCVD | |
PECVD | |
Coating | |
Spin coating | |
Spray coating | |
Electroplating | |
Epitaxial growth |
Thermal treatment of the sample |
---|
Make a mask on the sample |
---|
Lithography |
Imprinting |
Transfer pattern into the sample |
---|
Wet etch |
Dry etch |
Lift-off |
Direct structure definition |
---|
Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding samples together |
---|
Characterize the sample |
---|
Back end of the sample |
---|
Chip/die mounting |
Wire bonding |
Dicing |