Specific Process Knowledge: Difference between revisions
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==Overview of sample processing== | ==Overview of sample processing== | ||
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | ||
!Clean the sample | !Clean the sample [[File:cleaning.jpg|50px]] | ||
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | ||
!Drying Samples | !Drying Samples [[File:drying.jpg|50px]] | ||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | ||
!Make a layer on the sample | !Make a layer on the sample [[File:Making a layer 1.jpg|50px]] | ||
! | ! | ||
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Revision as of 14:40, 27 May 2014
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Overview of sample processing
Clean the sample |
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Drying Samples |
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Thermal treatment of the sample |
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Make a mask on the sample | |
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Lithography | |
Imprinting |
Transfer pattern into the sample |
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Wet etch |
Dry etch |
Lift-off |
Direct structure definition |
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Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding samples together |
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Characterize the sample |
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Back end of the sample |
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Chip/die mounting |
Wire bonding |
Dicing |