Specific Process Knowledge/Lithography/Development: Difference between revisions
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Development of | Development of | ||
*SU-8 | *SU-8 | ||
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Development of | |||
*AZ nLOF | |||
*AZ MiR 701 | |||
*AZ 5214E | |||
*AZ 4562 | |||
*DUV resists | |||
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(PGMEA) | (PGMEA) | ||
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AZ 726 MIF | |||
(2.38% TMAH in water) | |||
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Submersion | Submersion | ||
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Puddle | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters | ||
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22°C | 22°C | ||
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Room temperature | |||
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Room temperature | Room temperature | ||
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Magnetic stirrer | Magnetic stirrer | ||
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none | |||
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|style="background:LightGrey; color:black"|Rinse | |style="background:LightGrey; color:black"|Rinse | ||
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IPA | IPA | ||
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DI water | |||
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* 100 mm wafers | * 100 mm wafers | ||
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* 100 mm wafers | |||
* 150 mm wafers | |||
|- | |- | ||
| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
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Film or pattern of all but Type IV | Film or pattern of all but Type IV | ||
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Silicon, glass, and polymer substrates | |||
Film or pattern of all types | |||
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|style="background:LightGrey; color:black"|Batch | |style="background:LightGrey; color:black"|Batch | ||
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1-25 | 1-25 | ||
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1-6 | 1-6 | ||
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1 | |||
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