Specific Process Knowledge/Lithography/Development: Difference between revisions
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!style="background:silver; color:black | !style="background:silver; color:black" align="center" width="60"|Purpose | ||
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*AZ 5214E | *AZ 5214E | ||
*AZ 4562 | *AZ 4562 | ||
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!style="background:silver; color:black | !style="background:silver; color:black" align="center" width="60"|Developer | ||
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(NaOH and sodium borate salt) | (NaOH and sodium borate salt) | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method | |||
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Submersion | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters | |||
|style="background:LightGrey; color:black"|Temperature | |||
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22°C | |||
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|style="background:LightGrey; color:black"|Agitation | |||
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Manual | |||
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|style="background:LightGrey; color:black"|Rinse | |||
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DI water | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
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* 100 mm wafers | |||
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| style="background:LightGrey; color:black"|Allowed materials | |||
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Silicon, glass, and polymer substrates | |||
Film or pattern of all types | |||
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|style="background:LightGrey; color:black"|Batch | |||
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1-8 | |||
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