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Specific Process Knowledge/Lithography/Development: Difference between revisions

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!style="background:silver; width:100px; color:black;" align="center"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
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*Coating and baking of
Development of
**AZ5214E resist
*AZ 5214E
**AZ4562 resist
*AZ 4562
**E-beam resist
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*Coating and baking of
Development of
**AZ5214E resist
*AZ 5214E
**AZ4562 resist
*AZ 4562
**SU8 resist
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*Coating and baking of
Development of
**SU8 resist
*AZ 5214E
*AZ 4562
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*In-line substrate HMDS priming
Development of
*Coating and baking of  
*AZ 5214E
**AZ MiR 701 (29cps) resist
*AZ 4562
**AZ nLOF 2020 resist
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*Post-exposure baking at 110°C
Development of
*AZ 5214E
*AZ 4562


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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
!style="background:silver; color:black;" align="center" width="60"|Developer
|style="background:LightGrey; color:black"|Substrate handling
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* Cassette-to-cassette
AZ 351B diluted 1:5 in water
* Edge handling chuck
 
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(NaOH and sodium borate salt)
* Single substrate
* Non-vacuum chuck for fragile substrates
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* Cassette-to-cassette
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|style="background:LightGrey; color:black"|Permanent media
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* AZ5214E resist
* AZ4562 resist
* Acetone for chuck cleaning
* Acetone for drip pan
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* AZ5214E resist
* PGMEA for edge bead removal
* Acetone for chuck cleaning
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* AZ MiR 701 (29cps) resist
* AZ nLOF 2020 resist
* PGMEA for backside rinse and edge-bead removal
* PGMEA for spinner bowl cleaning and vapor tip bath
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|style="background:LightGrey; color:black"|Manual dispense option
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* 2 automatic syringes
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* yes
* pneumatic dispense for SU8 resist
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* no


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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate  size
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*50 mm wafers
*100 mm wafers
*150 mm wafers
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*100 mm wafer
*150 mm wafer
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*100 mm wafers
*150 mm wafers (tool change required)
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|style="background:LightGrey; color:black"|Batch size
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*1-24
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*1
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*1-25
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| style="background:LightGrey; color:black"|Allowed materials
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*All cleanroom materials except III-V materials
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*All cleanroom materials except III-V materials
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*Silicon
*Glass
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