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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
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[[Image:KSspinner.JPG|300x300px|right|thumb|Developer robot: TMAH is located in C-1]]
[[Image:KSspinner.JPG|300x300px|right|thumb|Developer robot: TMAH is located in C-1]]


'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer-TMAH click here]'''
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer_robot:_TMAH click here]'''


Developer-TMAH is a manually operated, single substrate spray-puddle developer. It uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in  water with a small amount of wetting agent). The substrates are loaded manually one by one into the developer. Developer dispense, puddle time, and a rough water rinse is performed automatically by the equipment.
Developer robot: TMAH will be installed Q3 2014.


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager]'''
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager]'''


===Process information===
===Process information===
'''Standard process recipes'''
*nLoF_40x2: double puddle, 40s. For development of AZ nLOF 2020 resist.
*MiR701 60s: single puddle, 60s. For development of AZ MiR 701 resist.
*DUV 60s: single puddle, 60s. For development of DUV resists.
'''Utility recipes'''
*UTIL-DR: Dome rinse.
*UTIL-BE: Bottle change. Danchip use only.


=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===


{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  


!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
Silicon, glass, and polymer substrates
Silicon and glass substrates


Film or pattern of all types
Film or pattern of all except Type IV
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
1
25
|-  
|-  
|}
|}


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