Specific Process Knowledge/Lithography/Development: Difference between revisions

← Older edit Newer edit →

VisualWikitext

@@ Line 157: / Line 157: @@
 {| border="2" cellspacing="0" cellpadding="2"
 !style="background:silver; color:black;" align="center" width="60"|Purpose
 |style="background:LightGrey; color:black"|
 |style="background:WhiteSmoke; color:black"|
-*Spin coating and soft baking UV sensative resists
+Development of
-*Spin coating and soft baking E-beam resists
+*AZ 5214E
+*AZ 4562
 |-
-!style="background:silver; color:black;" align="center" width="60"|Resist
+!style="background:silver; color:black;" align="center" width="60"|Developer
 |style="background:LightGrey; color:black"|
 |style="background:WhiteSmoke; color:black" align="center"|
-* AZ5214E
+AZ 351B (NaOH and sodium borate salt) diluted 1:5 in water
-* AZ4562
-* E-beam resists
 |-
-!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
+!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
-|style="background:LightGrey; color:black"|Coating thickness
+|style="background:LightGrey; color:black"|
 |style="background:WhiteSmoke; color:black" align="center"|
-* AZ5214E 1-4,2 µm
+Submersion
-* AZ4526 6,2-25 µm
-* E-beam resits 0,1-1 µm
 |-
-!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
-|style="background:LightGrey; color:black"|Spin speed
+|style="background:LightGrey; color:black"|Temperature
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|style="background:WhiteSmoke; color:black" align="center"|
-- 5000 rpm
+°C
-|-
-|style="background:LightGrey; color:black"|Spin acceleration
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-- 10000 rpm/s
 |-
-|style="background:LightGrey; color:black"|Hotplate temperature
+|style="background:LightGrey; color:black"|Agitation
 |style="background:WhiteSmoke; color:black" align="center"|
-* 90°C for softbaking of AZ5214E resist
+Manual
-* 100°C for softbaking of AZ4562 resist
-* 110°C for reverse baking of AZ5214E resits
-* 180°C for softbaking of e-beam resits
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Substrate size
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|style="background:WhiteSmoke; color:black" align="center"|
-* 50 mm wafers
 * 100 mm wafers
-* 150 mm wafers
 |-
 | style="background:LightGrey; color:black"|Allowed materials
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|style="background:WhiteSmoke; color:black" align="center"|
-All cleanroom materials except III-V materials
+All Silicon, glass and polymer substrates
 |-
 |style="background:LightGrey; color:black"|Batch
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|style="background:WhiteSmoke; color:black" align="center"|
-- 24
+-8
 |-
 |}