Specific Process Knowledge/Lithography/Development: Difference between revisions
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*Substrates can been spin-dried or dried with nitrogen gun after the rinse. | *Substrates can been spin-dried or dried with nitrogen gun after the rinse. | ||
The standard | The standard development time for AZ 5214E and AZ 4562 resists: | ||
*1.5µm resist is 60 sec | *1.5µm resist is 60 sec | ||
*2.2µm resist is 70 sec | *2.2µm resist is 70 sec | ||