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Specific Process Knowledge/Lithography/Development: Difference between revisions

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!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
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Development of
Development of
*AZ nLOF
*AZ nLOF
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*AZ 4562
*AZ 4562
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!style="background:silver; color:black;" align="center" width="60"|Developer chemistry
!style="background:silver; color:black;" align="center" width="60"|Developer  
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* AZ5214E permanent line
AZ 726 MIF (2.38% TMAH in water)
* AZ4562 manual dispense
* SU8 resists manual dispense
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!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
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* AZ5214E 1-4,2 µm
Puddle
* AZ4526 6,2-10 µm
* SU8 resits 0,1-100 µm
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:LightGrey; color:black"|Temperature
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100 - 5000 rpm
Room temperature
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|style="background:LightGrey; color:black"|Agitation
|style="background:LightGrey; color:black"|Agitation
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100 - 5000 rpm/s
none
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
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* 50 mm wafers
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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All cleanroom materials except III-V materials
All Silicon, glass and polymer substrates
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|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch