Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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The image to the left shows a schematic of the lift off process. | The image to the left shows a schematic of the lift off process. | ||
*1. The substrate is coated with the masking material. | *'''1.''' The substrate is coated with the masking material. | ||
*2. The masking material is patterned. The mask must be a negative image of the desired material pattern. The mask sidewalls should be negative in order to prevent the material covering the sidewalls during deposition. | *'''2'''. The masking material is patterned. The mask must be a negative image of the desired material pattern. The mask sidewalls should be negative in order to prevent the material covering the sidewalls during deposition. | ||
*3. The material is deposited on top of both mask and substrate. | *'''3'''. The material is deposited on top of both mask and substrate. | ||
*4. The masking matreial is dissolved, thus lifting part of the deposited material. | *'''4'''. The masking matreial is dissolved, thus lifting part of the deposited material. | ||
*5. The remaining material forms the desired pattern on the substrate. | *'''5'''. The remaining material forms the desired pattern on the substrate. | ||
<br clear="all" /> | <br clear="all" /> | ||