Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
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*[[/Spot size and optics|Spot size and optics]] | *[[/Spot size and optics|Spot size and optics]] | ||
{| border="1" cellspacing="2" cellpadding="2" colspan="3" | |||
|bgcolor="#FFFFFF" |'''Frequency and wavelength''' | |||
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{| {{table}} | |||
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{| border="1" cellspacing="1" cellpadding="2" align="center" style="width:200px" | |||
! Picosecond | |||
! 1064nm | |||
! 532nm | |||
! 355nm | |||
|- | |||
| Frequency min | |||
|200 kHz | |||
|200 kHz | |||
|200 kHz | |||
|- | |||
| Frequency max | |||
|8000 kHz | |||
|8000 kHz | |||
|8000 kHz | |||
{| border="1" cellspacing="1" cellpadding="2" align="center" style="width:200px" | |||
|- | |||
! Nanosecond | |||
! 1064nm | |||
|- | |||
| Frequency min | |||
|100kHz | |||
|- | |||
|- | |||
| Frequency max | |||
|100kHz | |||
|} | |||
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== Process information [[Image:section under construction.jpg|70px]] == | == Process information [[Image:section under construction.jpg|70px]] == | ||