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Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions

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*[[/Spot size and optics|Spot size and optics]]
*[[/Spot size and optics|Spot size and optics]]
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#FFFFFF" |'''Frequency and wavelength'''
|-
|
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:200px"
! Picosecond
! 1064nm
! 532nm
! 355nm
|-
| Frequency min
|200 kHz
|200 kHz
|200 kHz
|-
| Frequency max
|8000 kHz
|8000 kHz
|8000 kHz
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:200px"
|-
! Nanosecond
! 1064nm
|-
| Frequency min
|100kHz
|-
|-
| Frequency max
|100kHz
|}
|-
|}
|-
|}
|}


== Process information [[Image:section under construction.jpg|70px]] ==
== Process information [[Image:section under construction.jpg|70px]] ==