Specific Process Knowledge/Lithography/Strip: Difference between revisions

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 !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
-|style="background:LightGrey; color:black"|Minimum feature size
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+|style="background:WhiteSmoke; color:black"|
+Plasma ashing
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+Plasma ashing
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+Plasma ashing
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+Solvent
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+Solvent
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
+|style="background:LightGrey; color:black"|Process gasses
+|style="background:WhiteSmoke; color:black"|
+*O<sub>2</sub>
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 *
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-*
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-|-
+|style="background:LightGrey; color:black"|Process power
-!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
-|style="background:LightGrey; color:black"|Positive Process
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-|style="background:LightGrey; color:black"|Negative Process
+|style="background:LightGrey; color:black"|Solvent
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