Specific Process Knowledge/Thin film deposition/PECVD: Difference between revisions
| Line 120: | Line 120: | ||
| style="background:LightGrey; color:black"|Substrate material allowed | | style="background:LightGrey; color:black"|Substrate material allowed | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *Silicon wafers, Quartz (fused silica) wafers, | ||
**with layers of silicon oxide or silicon (oxy)nitride | |||
*III-V wafes (on special carriers) | |||
| | | | ||
*Silicon wafers | *Silicon wafers | ||