Specific Process Knowledge/Etch/Etching of Silicon Oxide: Difference between revisions
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*[[Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch]] | *[[Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch]] | ||
*[[/SiO2 etch using RIE1 or RIE2|SiO2 etch using | *[[/SiO2 etch using RIE1 or RIE2|SiO2 etch using RIE2]] | ||
*[[/SiO2 etch using AOE|SiO2 etch using AOE]] | *[[/SiO2 etch using AOE|SiO2 etch using AOE]] | ||
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | *[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | ||
*[[/SiO2 etch using Plasma Asher|SiO2 etch using Plasma Asher (isotropic)]] | *[[/SiO2 etch using Plasma Asher|SiO2 etch using Plasma Asher (isotropic)]] | ||
==Compare the methods for Silicon Oxide etching== | ==Compare the methods for Silicon Oxide etching== | ||