Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
No edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/LiftOff click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/LiftOff click here]''' | ||
=Comparing HMDS priming= | |||
{| border="2" cellspacing="0" cellpadding="2" | |||
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | |||
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific_Process_Knowledge/Lithography/Pretreatment#HMDS oven|HMDS oven]]</b> | |||
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]</b> | |||
|- | |||
!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black"| | |||
* HMDS priming | |||
|style="background:WhiteSmoke; color:black"| | |||
* HMDS priming only | |||
* HMDS priming and spin coating | |||
|- | |||
!style="background:silver; color:black;" align="center" width="60"|Priming chemical | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
hexamethyldisilizane (HMDS) | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | |||
|style="background:LightGrey; color:black"|Contact angle | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
standard recipe 82° (on SiO<sub>2</sub>) | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
60° - 90°; standard recipe 82° (on SiO<sub>2</sub>) | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters | |||
|style="background:LightGrey; color:black"|Process temperature | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
150°C | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
50°C | |||
|- | |||
|style="background:LightGrey; color:black"|Process time | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
32.5 minutes | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
3 min / wafer | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
* 50 mm wafers | |||
* 100 mm wafers | |||
* 150 mm wafers | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
100 mm wafers | |||
|- | |||
| style="background:LightGrey; color:black"|Allowed materials | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
All cleanroom materials | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Silicon (with oxide, nitride, or metal films or patterning) | |||
Glass (borosilicate and quartz) | |||
|- | |||
|style="background:LightGrey; color:black"|Batch | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
1 - 25, multiple batches possible | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
1 - 25 | |||
|- | |||
|} | |||
<br clear="all" /> | |||
=Lift-off Wet Bench= | =Lift-off Wet Bench= | ||