Specific Process Knowledge/Thermal Process/Dope with Phosphorus: Difference between revisions

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 ====Experiment setup====
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-There was used 20 boron doped wafers (p-type). There was used four wafer to the five different temperature. There was five dummy wafers on each side of the test wafers. The dummy wafer nearest to the test wafers was changed in between the runes so doping from a dummy wafer was minimized.
+boron doped wafers (p-type) was used. Four wafer to each of the five different predeposition temperatures. In the furnace was there five dummy wafers on each side of the processed wafers. The dummy wafer nearest to the test wafers was changed in between the runes so doping from a dummy wafer was minimized.
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