Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Thermal evaporation of Cr in Thermal evaporator: Difference between revisions
Appearance
| Line 73: | Line 73: | ||
=== '''Deposition of 100 nm''' === | === '''Deposition of 100 nm''' === | ||
The adjusted tooling factor 173%. Full 6" wafer is loaded with shadow-mask. Deposition thickness setpoint is set to 100 nm. | The adjusted tooling factor 173%. Full 6" wafer is loaded with shadow-mask. No rotation. Deposition thickness setpoint is set to 100 nm. | ||
Pressure fluctuations during the ramp-up: | Pressure fluctuations during the ramp-up: | ||