Specific Process Knowledge/Thermal Process/A4 Phosphor Pre-dep furnace: Difference between revisions

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==A4 Furnace Phosphor pre-dep==
'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/A4_Phosphor_Pre-dep_furnace click here]'''
[[Image:C4helstak.jpg|thumb|300x300px|A1 Boron drive in furnace: positioned in cleanroom 2]]


A4 is a furnace to dope Si wafers with Phosphor to make conductive lanes, etch stops etc. The doping source is Phosphoryl chloride (commonly called phosphorus oxychloride) is a colourless liquid with the formula POCl<sub>3</sub>.
''This page is written by DTU Nanolab  internal''
[[Category: Equipment |Thermal A4]]
[[Category: Thermal process|Furnace]]
[[Category: Furnaces|A4]]


A4 is the lowest furnace tube in the A-stack positioned in cleanroom 2. The A-stack together with furnace C2 are the cleanest of all our furnaces. Please be aware of which substrates are allowed to enter this furnace. Check the [http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=1250 cross contamination chart]. If you are in doubt, please send a mail to [mailto:furnace@danchip.dtu.dk furnace@danchip.dtu.dk].
==Phosphorus Pre-dep furnace (A4)==
[[Image:A4.JPG|thumb|300x300px|Phosphorus Pre-dep furnace (A4). Positioned in cleanroom B-1/ Photo: DTU Nanolab internal]]


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
The Phosphorus Pre-dep furnace (A4) is used to dope Si wafers with phosphorus to make conductive structures, etch stop layers etc. The doping source is phosphoryl chloride (commonly called phosphorus oxychloride) which is a colourless liquid with the chemical formula POCl<sub>3</sub>.


'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=47 Phosphor Pre-dep]'''
A4 is the lowest furnace tube in the A-stack positioned in cleanroom B-1. The furnaces in the A-stack are the cleanest of all furnaces in the cleanroom. Be aware of that all wafers (including new wafers) have to be RCA cleaned before they enter the furnace, and please check the cross contamination information in LabManager before you use the furnace.
 
 
'''The user manual, technical information and contact information can be found in LabManager:'''
 
'''[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=83 Phosphorus Pre-dep furnace (A4)]'''


== Process knowledge ==
== Process knowledge ==
*[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Dope with Phosphorus]]
*[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Dope with Phosphorus]]


==Overview of the performance of the Phosphor pre-dep furnace and some process related parameters==
==Overview of the performance of the Phosphorus Pre-dep furnace and some process related parameters==


{| border="2" cellspacing="0" cellpadding="0"  
{| border="2" cellspacing="0" cellpadding="2"  
|-
|-
!style="background:silver; color:black;" align="center"|Purpose  
!style="background:silver; color:black;" align="center"|Purpose  
|style="background:LightGrey; color:black"|Doping of Phosphor
|style="background:WhiteSmoke; color:black"|
|-
!style="background:silver; color:black" align="center"|Performance
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*
*Phosphorus doping/pre-deposition using POCl<sub>3</sub>
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
Line 34: Line 37:
|style="background:LightGrey; color:black"|Process pressure
|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 atm
*1 atm (atmospheric pressure)
|-
|-
|style="background:LightGrey; color:black"|Gasses on the system
|style="background:LightGrey; color:black"|Gasses on the system
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|


*POCL<sub>3</sub>
*POCl<sub>3</sub>
*N<sub>2</sub>
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1-30 4" wafer (or 2" wafers) per run
*1-30 100 mm wafers  
|-
|-
| style="background:LightGrey; color:black"|Substrate material allowed
| style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon wafers (new from the box or RCA cleaned)
*Silicon wafers (RCA cleaned)
*In doubt: look at the [http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=1250 cross contamination chart] or please send a mail to [mailto:furnace@danchip.dtu.dk furnace@danchip.dtu.dk]
|-
|-
|}
|}

Latest revision as of 15:08, 31 January 2023

Feedback to this page: click here

This page is written by DTU Nanolab internal

Phosphorus Pre-dep furnace (A4)

Phosphorus Pre-dep furnace (A4). Positioned in cleanroom B-1/ Photo: DTU Nanolab internal

The Phosphorus Pre-dep furnace (A4) is used to dope Si wafers with phosphorus to make conductive structures, etch stop layers etc. The doping source is phosphoryl chloride (commonly called phosphorus oxychloride) which is a colourless liquid with the chemical formula POCl3.

A4 is the lowest furnace tube in the A-stack positioned in cleanroom B-1. The furnaces in the A-stack are the cleanest of all furnaces in the cleanroom. Be aware of that all wafers (including new wafers) have to be RCA cleaned before they enter the furnace, and please check the cross contamination information in LabManager before you use the furnace.


The user manual, technical information and contact information can be found in LabManager:

Phosphorus Pre-dep furnace (A4)

Process knowledge

Overview of the performance of the Phosphorus Pre-dep furnace and some process related parameters

Purpose
  • Phosphorus doping/pre-deposition using POCl3
Process parameter range Process Temperature
  • 900-1150 oC
Process pressure
  • 1 atm (atmospheric pressure)
Gasses on the system
  • POCl3
  • N2
Substrates Batch size
  • 1-30 100 mm wafers
Substrate materials allowed
  • Silicon wafers (RCA cleaned)
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