Specific Process Knowledge/Lithography/Development/manualTMAH developer: Difference between revisions
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=Developer: TMAH Manual 02= | =Developer: TMAH Manual 02= | ||
[[file:Developer_TMAH_manual_02.jpg|400px|right|thumb|Developer: TMAH Manual 02 is located in E-4.]] | [[file:Developer_TMAH_manual_02.jpg|400px|right|thumb|Developer: TMAH Manual 02 is located in E-4.]] | ||
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'''Tool description'''<br> | '''Tool description'''<br> | ||
The Developer: TMAH manual 02 is a semi-automatic and programmable single substrate developer system, which can be used for development of resists on chips, 50 mm, 100 mm and 150 mm substrates. The development is done using AZ 726 MIF, which is a 2.38% TMAH solution with wetting agent. | The Developer: TMAH manual 02 is a semi-automatic and programmable single substrate developer system, which can be used for development of resists on chips, 50 mm, 100 mm and 150 mm substrates. The development is done using AZ 726 MIF, which is a 2.38% TMAH solution with wetting agent. | ||
Single substrates are loaded manually into the tool, but the developer dispense, puddle time, agitation, rinse and drying is controlled by the tool. | |||
{| class="wikitable" | {| class="wikitable" | ||
! style="text-align:left" | Product | ! style="text-align:left" | Product | ||
| style="padding-left: 10px" | Laurell EDC-650-HZB-23NP | | style="padding-left: 10px" | Laurell EDC-650-HZB-23NP | ||
|- | |- | ||
! style="text-align:left" | Year of purchase | ! style="text-align:left" | Year of purchase | ||
| style="padding-left: 10px" | 2016 | | style="padding-left: 10px" | 2016 | ||
|- | |- | ||
! style="text-align:left" | Tool modification | ! style="text-align:left" | Tool modification | ||
| style="padding-left: 10px" | | | style="padding-left: 10px" | | ||
Converted from e-beam solvent developer to UV TMAH developer in 2024<br> | |||
Added media flow controllers for developer, rinse and drying media in 2025 | |||
|- | |- | ||
! style="text-align:left" | Location | ! style="text-align:left" | Location | ||
| style="padding-left: 10px" | Cleanroom E-4 | | style="padding-left: 10px" | Cleanroom E-4 | ||
|} | |} | ||
'''User manual'''<br> | '''User manual'''<br> | ||
The user manual and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach= | The user manual and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=341 LabManager] - '''requires login''' | ||
'''Tool training'''<br> | '''Tool training'''<br> | ||
Training on the tool requires users to complete the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training lithography TPT] followed by the online tool training and a hands-on authorization training. | Training on the tool requires users to complete the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training lithography TPT] followed by the online tool training and a hands-on authorization training.<br> | ||
The tool training video is part of the online tool training, but can also be viewed [https://www.youtube.com/watch?v=btinNzYnLnY here]. | The tool training video is part of the online tool training, but can also be viewed [https://www.youtube.com/watch?v=btinNzYnLnY here]. | ||
<br clear="all" /> | <br clear="all" /> | ||
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! scope=row style="text-align: left;" | Substrate batch size | ! scope=row style="text-align: left;" | Substrate batch size | ||
| 1 | | 1 | ||
|- | |||
! scope=row style="text-align: left;" | Media flow rates | |||
| | |||
*AZ 726 MIF (TMAH): 300 ml/min | |||
*Process DI water: 400 ml/min | |||
*Backside rinse DI water: 140 ml/min | |||
*Process Nitrogen: 20 l/min | |||
|} | |} | ||
<br clear="all" /> | <br clear="all" /> | ||
=Process information= | =Process information= | ||
All recipes use the following structure: | All recipes use the following structure: | ||
#Pressurize the TMAH canister | #Pressurize the TMAH canister | ||
#Pre-wet substrate at high RPM | |||
#Dispense puddle while rotating substrate slowly | #Dispense puddle while rotating substrate slowly | ||
#Puddle development with agitation of substrate | #Puddle development with agitation of substrate | ||
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'''Multi puddle'''<br> | |||
Multi puddle recipes repeat steps 2-4 for the given number of puddles. | |||
==Process recipes== | ==Process recipes== | ||
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| colspan="2"|AZ 726 MIF (2.38% TMAH) | | colspan="2"|AZ 726 MIF (2.38% TMAH) | ||
|} | |} | ||
<br clear="all" /> | <br clear="all"/> | ||