Specific Process Knowledge/Lithography/Development/UV developer: Difference between revisions
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=Process Information= | =Process Information= | ||
*[[Specific Process Knowledge/Lithography/Development/Developer_TMAH_UV-lithography_processing | *[[Specific Process Knowledge/Lithography/Development/Developer_TMAH_UV-lithography_processing|General process information]] | ||
*[[Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography_processing#Process recommendations|Process recommendations]] | *[[Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography_processing#Process recommendations|Process recommendations]] | ||
*[[Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing#Standard Processes|Standard processes]] | *[[Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing#Standard Processes|Standard processes]] | ||
Latest revision as of 12:28, 12 January 2026
Developer TMAH UV-lithography
Developer TMAH UV-lithography was released Q4 2014.
Link to information about developer chuck size and hotplate pin positions.
The user manual, user APV, and contact information can be found in LabManager - requires login
Process Information
| Purpose |
Development of
| |
|---|---|---|
| Developer |
AZ 726 MIF (2.38% TMAH in water) | |
| Method | Development |
Puddle |
| Handling |
Vacuum chuck | |
| Process parameters | Temperature |
Room temperature |
| Agitation |
Rotation | |
| Rinse |
DI water | |
| Substrates | Substrate size |
|
| Allowed materials |
Silicon and glass substrates Film or pattern of all except Type IV | |
| Batch |
1-25 |