Specific Process Knowledge/Lithography/Strip/plasmaAsher05: Difference between revisions
Created page with "=Plasma Asher 5= 400px|thumb|Plasma asher 5 in cleanroom E-5.|right Product name: PVA Tepla Gigabatch 380M<br> Year of purchase: 2024 The Plasma Asher 5 can be used for the following processes: *Photoresist stripping *Descumming *Surface cleaning *Removal of organic passivation layers and masks Furthermore plasma processing using CF<sub>4</sub> in plasma asher 5 can be used for: *Etching of glass and ceramic *Etching of SiO<sub>2</sub>, Si<sub>3..." |
|||
| Line 21: | Line 21: | ||
The user manual, risk assessment, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=531 LabManager] - '''requires login''' | The user manual, risk assessment, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=531 LabManager] - '''requires login''' | ||
==Process Information== | |||
Plasma asher 5 is identical to plasma asher 4, see resist strip processing for plasma asher 4 [[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4|here]]. | Plasma asher 5 is identical to plasma asher 4, see resist strip processing for plasma asher 4 [[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4|here]]. | ||
