Specific Process Knowledge/Lithography/Development/manualTMAH developer: Difference between revisions
Created page with "==Developer: TMAH Manual 02== 400px|right|thumb|Developer: TMAH Manual 02 is located in E-4. Developer: TMAH Manual 02 is a manually operated puddle developer for single wafers or chips. The wafers or chips are loaded manually one by one into the developer, but the developer dispense, puddle time, water rinse, and drying is performed automatically. The development uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in water with a small amoun..." |
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=Developer: TMAH Manual 02= | |||
[[ | [[file:Developer_TMAH_manual_02.jpg|400px|right|thumb|Developer: TMAH Manual 02 is located in E-4.]] | ||
Developer: TMAH | '''Tool description'''<br> | ||
The Developer: TMAH manual 02 is a semi-automatic and programmable single substrate developer system, which can be used for development of resists on chips, 50 mm, 100 mm and 150 mm substrates. The development is done using AZ 726 MIF, which is a 2.38% TMAH solution with wetting agent. | |||
Single substrates are loaded manually into the tool, but the developer dispense, puddle time, agitation, rinse and drying is controlled by the tool. | |||
{| class="wikitable" | |||
! style="text-align:left" | Product: | |||
| style="padding-left: 10px" | Laurell EDC-650-HZB-23NP | |||
|- | |||
! style="text-align:left" | Year of purchase: | |||
| style="padding-left: 10px" | 2016 | |||
|- | |||
! style="text-align:left" | Tool modification: | |||
| style="padding-left: 10px" | Modified from e-beam solvent developer to UV TMAH developer in 2024 | |||
|- | |||
! style="text-align:left" | Location: | |||
| style="padding-left: 10px" | Cleanroom E-4 | |||
|} | |||
The user manual | '''User manual'''<br> | ||
The user manual and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=341 LabManager] - '''requires login''' | |||
'''Tool training'''<br> | |||
Training on the tool requires users to complete the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training lithography TPT] followed by the online tool training and a hands-on authorization training.<br> | |||
The tool training video is part of the online tool training, but can also be viewed [https://www.youtube.com/watch?v=btinNzYnLnY here]. | |||
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=Equipment performance and process related parameters= | |||
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! scope=row style="text-align: left;" | Developer | ! scope=row style="text-align: left;" | Developer | ||
| | | AZ 726 MIF (2.38% TMAH) | ||
AZ 726 MIF | |||
(2.38% TMAH) | |||
|- | |- | ||
! scope=row style="text-align: left;" | Development method | ! scope=row style="text-align: left;" | Development method | ||
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|} | |} | ||
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=Process information= | |||
All recipes use the following structure: | |||
#Pressurize the TMAH canister | |||
#Dispense puddle while rotating substrate slowly | |||
#Puddle development with agitation of substrate | |||
#Spin off developer | |||
#Clean substrate and chamber with DI water | |||
#Dry substrate and chamber with nitrogen | |||
'''Multi puddle'''<br> | |||
Multi puddle recipes repeat steps 2-4 for the given number of puddles. | |||
==Process recipes== | |||
(Updated 2026-01-12, JEHEM) | |||
*-Rinse- | |||
*1x015s | |||
*1x030s | |||
*1x060s | |||
*1x120s | |||
*2x060s | |||
*5x060s | |||
==Agitation== | |||
Testing showed that adding agitation to the puddle step gave better uniformity in the development rate over the entire area of the substrate as well as increased development rate. | |||
Tests were performed on under-exposed resist, specifically for showing the difference between the agitation and non-agitation puddle development - the measured results cannot necessarily be transferred directly to a working process, only the vague general behavior of the two process setups; faster/slower development speed and better/worse uniformity across substrate. | |||
[[file:ManualTMAHdeveloper developRate v1.png|400px|thumb|Development rate for under-exposed resist test]] | |||
[[file:ManualTMAHdeveloper uniformity v1.png|400px|thumb|Non-uniformity for under-exposed resist test]] | |||
{| class="wikitable" | |||
|- | |||
! !! Non-agitation !! Agitation | |||
|- | |||
! scope=row style="text-align: left;" | Test results | |||
| | |||
*Slower development | |||
*Worse uniformity | |||
| | |||
*Faster development | |||
*Better uniformity | |||
|- | |||
! scope=row style="text-align: left;" | Normalized development rate | |||
| 1 || 1.20 | |||
|- | |||
! scope=row style="text-align: left;" | Non-uniformity | |||
| 21% || 11% | |||
|- | |||
! scope=row style="text-align: left;" | Agitation | |||
| None || 15 cycles per minute, 20 rpm, 500 rpm/s | |||
|- | |||
! scope=row style="text-align: left;" | Substrate | |||
| colspan="2"|100 mm SSP silicon | |||
|- | |||
! scope=row style="text-align: left;" | Resist film | |||
| colspan="2"|1.5 µm AZ 5214E | |||
|- | |||
! scope=row style="text-align: left;" | Exposure dose | |||
| colspan="2"|50 mJ/cm<sup>2</sup> (~50% of normal dose) | |||
|- | |||
! scope=row style="text-align: left;" | Development | |||
| colspan="2"|Single puddle for 60 seconds | |||
|- | |||
! scope=row style="text-align: left;" | Developer | |||
| colspan="2"|AZ 726 MIF (2.38% TMAH) | |||
|} | |||
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