Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions
| (2 intermediate revisions by the same user not shown) | |||
| Line 11: | Line 11: | ||
=Spin coating= | =Spin coating= | ||
Spin coating on Spin Coater: RCD8 consists of a selection of the following steps: | Spin coating on Spin Coater: RCD8 consists of a selection of the following steps: | ||
#Resist dispense | #Resist dispense | ||
#(Recipe start) | |||
#Optional: Closing the Gyrset (if used) | #Optional: Closing the Gyrset (if used) | ||
#Optional: Resist spreading at low spin speed | #Optional: Resist spreading at low spin speed | ||
#Spin-off | #Spin-off | ||
#Deceleration | #Deceleration | ||
#Opening Gyrset | #Opening Gyrset (if used) | ||
The wafer is first centered on the chuck and held in place by vacuum (or pins in the case of the non-vacuum chuck). | The wafer is first centered on the chuck and held in place by vacuum (or pins in the case of the non-vacuum chuck). After the resist has been dispensed, the recipe is started. A short spin at low spin speed may be used as the first step of the recipe, in order to spread the resist over the wafer surface before spin-off. | ||
The spin-off cycle determines the thickness of the resist coating. The thickness is primarily a function of the spin-off speed and the spin-off time, both following an inverse power-law. | The spin-off cycle determines the thickness of the resist coating. The thickness is primarily a function of the spin-off speed and the spin-off time, both following an inverse power-law. | ||
| Line 27: | Line 27: | ||
=Dispense= | =Dispense= | ||
Resist dispense on the Spin Coater: RCD8 can only be done manually, as the motorized media arm was decommissioned in 2024. Manual dispense is done by administering the resist directly onto the substrate, after it has been loaded into the machine but before the recipe has been started. In most cases, it is done by pushing the resist out of a prefilled syringe. Thin resists can be dispensed by pouring the resist directly from a bottle, but that is more difficult to control. | Resist dispense on the Spin Coater: RCD8 can only be done manually, as the motorized media arm was decommissioned in 2024. Manual dispense is done by administering the resist directly onto the substrate, after it has been loaded into the machine but before the recipe has been started. In most cases, it is done by pushing the resist out of a prefilled syringe (dispense cartridge). Thin resists can be dispensed by pouring the resist directly from a bottle, but that is more difficult to control. | ||
The volume dispensed from a syringe may be estimated by measuring the distance the resist level is displaced during a dispense, and calculating the corresponding volume using the diameter of the syringe (23 mm). A displacement of 10 mm corresponds to a dispensed volume of 4 ml. This calculation can also be used to mark the syringe with appropriately spaced guide lines in order to dispense a specific volume. | The volume dispensed from a syringe may be estimated by measuring the distance the resist level is displaced during a dispense, and calculating the corresponding volume using the diameter of the syringe (23 mm). A displacement of 10 mm corresponds to a dispensed volume of 4 ml. This calculation can also be used to mark the syringe with appropriately spaced guide lines in order to dispense a specific volume. 4-5 ml is an appropriate volume for a 100 mm wafer. | ||
==Tips and tricks for dispensing thick resist== | ==Tips and tricks for dispensing thick resist== | ||