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Specific Process Knowledge/Back-end processing: Difference between revisions

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{| {{table} style="background:LightGray"}
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! '''Note! Packlab is currently under re-construction and planned to re-open in Q2 2025.'''
! '''Note! The SupportLab (former Packlab) has been established and tools are currently relocated.'''
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<br>
| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.  
Please note that the training on machines requires the "Introduction course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information.  
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Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.  
Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.  
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* Chip/die mounting
* Chip/die mounting
**[[/Die Bonder|Die Bonder (eutectic metal)]] [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''
**[[/Die Bonder|Die Bonder (eutectic metal)]]  
<br>
*Wire bonding
*Wire bonding
**[[/Wire Bonder|TPT Wire Bonder]] [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''
**[[/Wire Bonder|TPT Wire Bonder]]  
**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
*Wafer dicing/machining
<br>
*Wafer Dicing and Machining
**[[/Polisher CMP|Polisher CMP - located in the cleanroom]]
**[[/Polisher CMP|Polisher CMP - located in the cleanroom]]
**[[/Polishing machine|Polisher/Lapper machine]] !! Machine decommissioned end of 2024 !!
**[[/Polishing machine|Polisher/Lapper machine]]  
**[[/LatticeAxe|LatticeAxe]]
**[[/LatticeAxe|LatticeAxe]]
**[[/FlipScribe|FlipScribe]]
**[[/FlipScribe|FlipScribe]]
**[[/FlexScribe|FlexScribe]]
**[[/FlexScribe|FlexScribe]]
**[[/Wafer Scriber|Wafer Scriber]]
**Wafer Scriber
**[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
**[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
**[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
**[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
**[[/Disco Saw|Wafer cleaner DCS 1441 (post dicing)]]
**[[/Disco Saw|Wafer cleaner DCS 1441 (post dicing)]]
**[[/Laser Micromachining Tool|Laser Micromachining Tool]]
**[[/Laser Micromachining Tool|Laser Micromachining Tool]]
*Molding
<br>
**[[/Polymer Injection Molder|Polymer Injection Molder]] !! Machine now owned and moved to DTU Construct !!
*Pick & place
**[[/Hot Embosser|Hot Embosser]]
**[[/Micro transfer printer|Micro transfer printer]]
 
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* X-ray inspection system
* X-ray inspection system
**[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]]
**[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]]
  -->
  -->
*Pick & place
**[[/Micro transfer printer|Micro transfer printer]]


== Choose processing method ==
== Choose processing method ==
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*[[/Polishing machine|Polisher/Lapper machine]]
*[[/Polishing machine|Polisher/Lapper machine]]
|style="background: LightGray"|
|style="background: LightGray"|
*[[/Wafer Scriber|Wafer Scriber]]
*Diamond Pen (Wafer Scriber)
*[[/LatticeAxe|LatticeAxe]]  
*[[/LatticeAxe|LatticeAxe]]  
*[[/FlipScribe|FlipScribe]]
*[[/FlipScribe|FlipScribe]]
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