Specific Process Knowledge/Pattern Design: Difference between revisions
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= Pattern Design = | |||
For making a pattern on a substrate it is necessary to use a software tool to design the pattern layout. This counts for all kind of lithography and laser cutting. There are a number of different software tools that can be used, some of the more commonly used are: | For making a pattern on a substrate it is necessary to use a software tool to design the pattern layout. This counts for all kind of lithography and laser cutting. There are a number of different software tools that can be used, some of the more commonly used are: | ||
* CleWin | * CleWin | ||
* KLayout (free) | * KLayout (free) link: https://www.klayout.de/ | ||
* L-Edit | * L-Edit | ||
* Autocad | * Autocad | ||
At Nanolab we offer all users '''free access to CleWin 6 | At Nanolab we offer all users '''free access to CleWin 6''' for their mask layout. You can find more information on how to install CleWin 6 on your local computer [[Specific Process Knowledge/Pattern Design/CleWin|'''here''']]. | ||
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== Layout file format== | |||
There are different file formats available and not all equipment can handle each of them. | |||
* For '''E-beam lithography''' you need to prepare a set of files (GDS, V30, sdf, jdf and mgn files). For details | * For '''UV-lithography''', you create a layout file with your design. The file format should preferably be CIF or GDS, though DXF, or GERBER is acceptable too. The electronic mask layout can be used directly in one of our [[Specific Process Knowledge/Lithography/UVExposure|Mask Less Aligners (MLAs)]] or you can have a physical mask produced based on the layout file for our [[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-2|Mask Aligner]]. For more details see below [[Specific_Process_Knowledge/Pattern_Design#Mask_Ordering_and_Fabrication|Mask Fabrication for UV-lithography]]. | ||
* For '''DUV-lithography''', a physical mask, called "reticles", is required. The file format must be GDS. For more details concerning the design of reticles see [[Specific_Process_Knowledge/Lithography/DUVStepperLithography/Reticle_Design|Reticle Design]]. | |||
* For ''' | * For '''E-beam lithography''', you need to prepare a set of files (GDS, V30, sdf, jdf and mgn files). For more details, please see [[Specific_Process_Knowledge/Lithography/EBeamLithography/FilePreparation#FilePreparation|File preparation]]. For details about how to make aligned E-beam patterns, please have at look at [[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#Design_of_global_marks_and_chip_marks|Design of global marks and chip marks]] | ||
* For '''Laser Cutting''' using our [Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool], the layout file must be saved as DXF file. | |||
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== Mask Design for UV-lithography == | == Mask Design for UV-lithography == | ||
Here you can find tips and tricks for mask designing. | Here you can find tips and tricks for mask designing. | ||
* [[Media: | * [[Media:Beginners guide to mask design using Clewin v1.4.pdf|"Beginners guide to mask design"]]. This is a guide how to design a set of mask. | ||
* [[Media:Guide to mask making.pdf | Guide to mask making.pdf]]. Unfortunately this is quite old guide to mask design, but may be useful anyway. Note some links/e-mails etc. are not correct anymore and the mask specifications (CU/CD, DF/BF, RR/WR) are no longer valid. | * [[Media:Guide to mask making.pdf| Guide to mask making.pdf]]. Unfortunately this is quite old guide to mask design, but may be useful anyway. Note some links/e-mails etc. are not correct anymore and the mask specifications (CU/CD, DF/BF, RR/WR) are no longer valid. | ||
* [[Media:Mask polarity and orientation.pdf | Mask polarity and orientation.pdf]]. This is an short guide how to specify the polarity and orientation of the mask when ordering as well as when used on our maskless aligners. Be aware that the specification of polarity and orientation when ordering at Compugraphics is not the same as when ordering at Delta Mask as we used to do. | * [[Media:Mask polarity and orientation.pdf| Mask polarity and orientation.pdf]]. This is an short guide how to specify the polarity and orientation of the mask when ordering as well as when used on our maskless aligners. Be aware that the specification of polarity and orientation when ordering at Compugraphics is not the same as when ordering at Delta Mask as we used to do. | ||
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===Alignment marks=== | ===Alignment marks=== | ||
The following alignment marks are suggested to use on the Mask aligners for good pattern recognition. Pleased be adviced that they can be removed in KOH etching. | The following alignment marks are suggested to use on the Mask aligners for good pattern recognition. Pleased be adviced that they can be removed in KOH etching. | ||
*Mask aligner: | *Mask aligner: | ||
**[[Media:Alignmentkeys1.cif|Alignment marks 1 .cif]] (Right click and Use "save link as...") - ''You need the program "Clewin" to open this file'' | **[[Media:Alignmentkeys1.cif|Alignment marks 1 (.cif)]] (Right click and Use "save link as...") - ''You need the program "Clewin" to open this file'' | ||
**[[Media:Alignmentkeys1.tdb|Alignment marks 1 .tdb]] - ''You need the program "L-Edit" to open this file'' | **[[Media:Alignmentkeys1.tdb|Alignment marks 1 (.tdb)]] - ''You need the program "L-Edit" to open this file'' | ||
*Maskless aligner: | *Maskless aligner: | ||
**[[Media: | **[[Media:MLA AlignmentMarks simple.gds|Simple alignment marks (.gds)]] | ||
**[[Media:MLA_alignmentMarks_arrows. | **[[Media:MLA_alignmentMarks_arrows.cif|Alignment marks with structures to assist in locating the marks during alignment (.cif)]] | ||
**[[Media:AlignmentMark_KOH. | **[[Media:AlignmentMark_KOH.cif|Alignment mark for multiple layers, Layer 1 for etch in KOH (.cif)]] | ||
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===Alignment marks location=== | |||
For the [[ | For the mask aligners [[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-1|MA6-1]] and [[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-2|MA6-2]] | ||
* | *For Top Side Alignment (TSA) alignment marks should be located 35-80 mm in left and right in horizontal location (X) from mask center and between -20 and +20 mm in vertical location (Y) | ||
*For Back Side Alignment (BSA) alignment marks should be located 15-45 mm in left and right in horizontal location (X) from mask center and between -20 and +20 mm in vertical location (Y) | |||
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=== Alignment marks for E-beam lithography === | === Alignment marks for E-beam lithography === | ||
If your UV mask is used to define wafers marks in e-beam lithography with JEOL JBX-9500, you should design your alignment marks in a way the JEOL JBX-9500 recognizes. Please follow the guide [ | If your UV mask is used to define wafers marks in e-beam lithography with JEOL JBX-9500, you should design your alignment marks in a way the JEOL JBX-9500 recognizes. Please follow the guide [[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOLAlignment|to e-beam alignment here]] | ||
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=== Helpful information for chip layout === | === Helpful information for chip layout === | ||
*[[Media:Gamma coater & developer chucks + hotplate pins.gds|Gamma coater & developer chucks + hotplate pins.gds]] Design file showing the size of the chucks and the position of the hotplate pins in the Gamma tools. | *[[Media:Gamma coater & developer chucks + hotplate pins.gds|Gamma coater & developer chucks + hotplate pins.gds]] Design file showing the size of the chucks and the position of the hotplate pins in the Gamma tools. | ||
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== Mask Ordering and Fabrication == | == Mask Ordering and Fabrication == | ||
Our standard mask supplier is [https://www.macdermidalpha.com/semiconductor-solutions/compugraphics Compugraphics]. They can provide 5" and 7" masks on soda lime glass or quartz. Minimum feature size can be 0.8µm, 1µm or 1.5µm which is reflected in the price. Read a short guide on[[Media:Mask Ordering Guide.pdf| how to order photomasks from Compugraphics]] here. Templates for the mask specifications for 5" and 7" masks respectively can be seen [[/Mask Specifications| <b>here</b>.]] | |||
The masks have to be ordered in Procure. Nanolab cannot order the mask for you but we do offer a final check of the design and mask specifications before you place the order. You can find a guide on [[Media:Maskordering in Fusion.pdf| how to order and attach design files in procure]] here. | |||
The masks have to be ordered in Procure. Nanolab cannot order the mask for you but we do offer a final check of the design and mask specifications before you place the order. You can find a guide on [[Media: | |||
If you are using L-edit to design your mask you should remember to mark the top cell as the fabrication cell; a small pink <b style="color:magenta">''f''</b> should show to the left of the cell name in the Design Navigator. | If you are using L-edit to design your mask you should remember to mark the top cell as the fabrication cell; a small pink <b style="color:magenta">''f''</b> should show to the left of the cell name in the Design Navigator. | ||
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Give each layer appropriate GDS number respectively CIF names before exporting the file. This is done by double click on the layers and fill out the window that pops up. | Give each layer appropriate GDS number respectively CIF names before exporting the file. This is done by double click on the layers and fill out the window that pops up. | ||
We can also provide guidance regarding the mask design phase. Please contact the | We can also provide guidance regarding the mask design phase. Please contact the [mailto:nanolabsupport@nanolab.dtu.dk | Fabrication Support Team] for help and review. | ||
*[[Media: | *[[Media:Maskordering in Fusion.pdf| How to order and attach design files in DTU Fusion]] | ||
*[[ | *[[/Mask Specifications| Templates for 5" and 7" Mask Specifications]] | ||
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== | == QC masks (DTU Nanolab)== | ||
This section contains a description of some of the quality control designs. | This section contains a description of some of the quality control designs. | ||
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* [[file:dASEfeRIE.tdb | The L-Edit design file]] | * [[file:dASEfeRIE.tdb | The L-Edit design file]] | ||
'''Masks for process development''' | |||
*[[Specific Process Knowledge/Pattern Design/Travka|Travka mask set (7 masks)]] | *[[Specific Process Knowledge/Pattern Design/Travka|Travka mask set (7 masks)]] | ||
Latest revision as of 12:47, 31 October 2025
The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.
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Pattern Design
For making a pattern on a substrate it is necessary to use a software tool to design the pattern layout. This counts for all kind of lithography and laser cutting. There are a number of different software tools that can be used, some of the more commonly used are:
- CleWin
- KLayout (free) link: https://www.klayout.de/
- L-Edit
- Autocad
At Nanolab we offer all users free access to CleWin 6 for their mask layout. You can find more information on how to install CleWin 6 on your local computer here.
Layout file format
There are different file formats available and not all equipment can handle each of them.
- For UV-lithography, you create a layout file with your design. The file format should preferably be CIF or GDS, though DXF, or GERBER is acceptable too. The electronic mask layout can be used directly in one of our Mask Less Aligners (MLAs) or you can have a physical mask produced based on the layout file for our Mask Aligner. For more details see below Mask Fabrication for UV-lithography.
- For DUV-lithography, a physical mask, called "reticles", is required. The file format must be GDS. For more details concerning the design of reticles see Reticle Design.
- For E-beam lithography, you need to prepare a set of files (GDS, V30, sdf, jdf and mgn files). For more details, please see File preparation. For details about how to make aligned E-beam patterns, please have at look at Design of global marks and chip marks
- For Laser Cutting using our [Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool], the layout file must be saved as DXF file.
Mask Design for UV-lithography
Here you can find tips and tricks for mask designing.
- "Beginners guide to mask design". This is a guide how to design a set of mask.
- Guide to mask making.pdf. Unfortunately this is quite old guide to mask design, but may be useful anyway. Note some links/e-mails etc. are not correct anymore and the mask specifications (CU/CD, DF/BF, RR/WR) are no longer valid.
- Mask polarity and orientation.pdf. This is an short guide how to specify the polarity and orientation of the mask when ordering as well as when used on our maskless aligners. Be aware that the specification of polarity and orientation when ordering at Compugraphics is not the same as when ordering at Delta Mask as we used to do.
Alignment marks
The following alignment marks are suggested to use on the Mask aligners for good pattern recognition. Pleased be adviced that they can be removed in KOH etching.
- Mask aligner:
- Alignment marks 1 (.cif) (Right click and Use "save link as...") - You need the program "Clewin" to open this file
- Alignment marks 1 (.tdb) - You need the program "L-Edit" to open this file
- Maskless aligner:
Alignment marks location
For the mask aligners MA6-1 and MA6-2
- For Top Side Alignment (TSA) alignment marks should be located 35-80 mm in left and right in horizontal location (X) from mask center and between -20 and +20 mm in vertical location (Y)
- For Back Side Alignment (BSA) alignment marks should be located 15-45 mm in left and right in horizontal location (X) from mask center and between -20 and +20 mm in vertical location (Y)
Alignment marks for E-beam lithography
If your UV mask is used to define wafers marks in e-beam lithography with JEOL JBX-9500, you should design your alignment marks in a way the JEOL JBX-9500 recognizes. Please follow the guide to e-beam alignment here
Helpful information for chip layout
- Gamma coater & developer chucks + hotplate pins.gds Design file showing the size of the chucks and the position of the hotplate pins in the Gamma tools.
Mask Ordering and Fabrication
Our standard mask supplier is Compugraphics. They can provide 5" and 7" masks on soda lime glass or quartz. Minimum feature size can be 0.8µm, 1µm or 1.5µm which is reflected in the price. Read a short guide on how to order photomasks from Compugraphics here. Templates for the mask specifications for 5" and 7" masks respectively can be seen here.
The masks have to be ordered in Procure. Nanolab cannot order the mask for you but we do offer a final check of the design and mask specifications before you place the order. You can find a guide on how to order and attach design files in procure here.
If you are using L-edit to design your mask you should remember to mark the top cell as the fabrication cell; a small pink f should show to the left of the cell name in the Design Navigator.
Remember to make only the layers for fabrication visible. The remaining should be invisible. Give each layer appropriate GDS number respectively CIF names before exporting the file. This is done by double click on the layers and fill out the window that pops up.
We can also provide guidance regarding the mask design phase. Please contact the | Fabrication Support Team for help and review.
QC masks (DTU Nanolab)
This section contains a description of some of the quality control designs.
ASE standardisation designs: The quality control procedure on the ASE is using the daqmask 2 mask
RIE standardisation design:
The quality control procedures on RIE2 is using the dASEfeRIE mask
Masks for process development