Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 2kW micro: Difference between revisions

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<!--Checked for updates on 28/6-2023 - ok/jmli -->
<!--Checked for updates on 11/11-2024 - ok/jmli -->
 


{{contentbydryetch}}
{{contentbydryetch}}
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=DREM 2kW runs on complete set of Travka 5 to 80 % wafers=
=DREM 2kW runs on complete set of Travka 5 to 80 % wafers=


{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;"
{{Template:ProcessRunPeg1Head
|-
 
! rowspan="2" width="40"| Date
|TableHeader=DREM response to variations is trench widths and etch loads
! colspan="2" width="120"| Substrate Information
|TableStyle = class="wikitable"  
! colspan="4" | Process Information
|PaddingStyle=padding:0px;
! colspan="2" | Results
|PaddingStyle=padding:0px;
|-
|title=Sploof
! width="30" | Wafer info
}} 
! width="40" | Material/ Exposed area
{{Template:ProcessRunPeg1Row
! width="40" | Condi- tioning
|RunDate =27/4-2020
! width="40" | Recipe
|WaferInfo =Travka05 wafer
! width="40" | Wafer ID
|MaterialExposed=Si /  5%
! width="40" | Comments
|Tool=Peg 1
! width="400" |[[Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope|Picoscope]]
|Conditioning=S022327 DREM 2kW RF MU runs
! width="400" |Numbers
|Recipe=nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes
|-
|WaferID=S022328
! style="background:gainsboro; color:black;" rowspan="2"|27/4-2020
|Comments=Resist etch rate: 62 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
|Travka05 wafer,
|SEMimages=[[file:S022328a049.png |120px|frameless ]][[file:S022328a050.png |120px|frameless ]][[file:S022328a051.png |120px|frameless ]][[file:S022328a052.png |120px|frameless ]][[file:S022328a053.png |120px|frameless ]][[file:S022328a054.png |120px|frameless ]][[file:S022328a055.png |120px|frameless ]][[file:S022328a056.png |120px|frameless ]][[file:S022328a057.png |120px|frameless ]][[file:S022328a058.png |120px|frameless ]][[file:S022328a059.png |120px|frameless ]][[file:S022328a060.png |120px|frameless ]]
|Si /  5%
|PicoscopeImages= [[file:S022328.gif |120px|frameless ]][[file:S022328 01.gif |120px|frameless ]][[file:S022328 02.gif |120px|frameless ]][[file:S022328 03.gif |120px|frameless ]][[file:S022328 04.gif |120px|frameless ]][[file:S022328 05.gif |120px|frameless ]][[file:S022328 06.gif |120px|frameless ]][[file:S022328 07.gif |120px|frameless ]][[file:S022328 08.gif |120px|frameless ]][[file:S022328 09.gif |120px|frameless ]][[file:S022328 10.gif |120px|frameless ]][[file:S022328 11.gif |120px|frameless ]][[file:S022328 12.gif |120px|frameless ]][[file:S022328 13.gif |120px|frameless ]][[file:S022328 14.gif |120px|frameless ]][[file:S022328 15.gif |120px|frameless ]]
|S022327 DREM 2kW RF MU runs
}}
|nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes
|S022328
|Resist etch rate: 62 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
| [[file:S022328.gif |120px|frameless ]]
[[file:S022328 01.gif |120px|frameless ]]
[[file:S022328 02.gif |120px|frameless ]]
[[file:S022328 03.gif |120px|frameless ]]
[[file:S022328 04.gif |120px|frameless ]]
[[file:S022328 05.gif |120px|frameless ]]
[[file:S022328 06.gif |120px|frameless ]]
[[file:S022328 07.gif |120px|frameless ]]
[[file:S022328 08.gif |120px|frameless ]]
[[file:S022328 09.gif |120px|frameless ]]
[[file:S022328 10.gif |120px|frameless ]]
[[file:S022328 11.gif |120px|frameless ]]
[[file:S022328 12.gif |120px|frameless ]]
[[file:S022328 13.gif |120px|frameless ]]
[[file:S022328 14.gif |120px|frameless ]]
[[file:S022328 15.gif |120px|frameless ]]
<!-- Add picoscope links here:[[file:S022328 |120px|frameless ]] -->
<!-- [[/S022328 | Single gifs ]] -->
|
{| {{table}}  
{| {{table}}  
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
Line 79: Line 58:
|-  
|-  
|}
|}
|-
| style="background:gainsboro; color:black;" colspan="8"|
[[file:S022328a049.png |120px|frameless ]]
[[file:S022328a050.png |120px|frameless ]]
[[file:S022328a051.png |120px|frameless ]]
[[file:S022328a052.png |120px|frameless ]]
[[file:S022328a053.png |120px|frameless ]]
[[file:S022328a054.png |120px|frameless ]]
[[file:S022328a055.png |120px|frameless ]]
[[file:S022328a056.png |120px|frameless ]]
[[file:S022328a057.png |120px|frameless ]]
[[file:S022328a058.png |120px|frameless ]]
[[file:S022328a059.png |120px|frameless ]]
[[file:S022328a060.png |120px|frameless ]]
|-
| colspan="9"| .
|-
|-
! style="background:gainsboro; color:black;" rowspan="2"|27/4-2020
{{Template:ProcessRunPeg1Row
|Travka10 wafer,
|RunDate =27/4-2020
|Si /  10%
|WaferInfo =Travka10 wafer,
|S022328 +1min TDESC clean
|MaterialExposed=Si /  10%
|nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes
|Tool=Peg 1
|S022329
|Conditioning=S022328 +1min TDESC clean
|Resist etch rate: 60 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
|Recipe=nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes
| [[file:S022329.gif |120px|frameless ]]
|WaferID=S022329
[[file:S022329 01.gif |120px|frameless ]]
|Comments=Resist etch rate: 60 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
[[file:S022329 02.gif |120px|frameless ]]
|SEMimages=[[file:S022329a061.png |120px|frameless ]][[file:S022329a062.png |120px|frameless ]][[file:S022329a063.png |120px|frameless ]][[file:S022329a064.png |120px|frameless ]][[file:S022329a065.png |120px|frameless ]][[file:S022329a066.png |120px|frameless ]][[file:S022329a067.png |120px|frameless ]][[file:S022329a068.png |120px|frameless ]][[file:S022329a069.png |120px|frameless ]][[file:S022329a070.png |120px|frameless ]][[file:S022329a071.png |120px|frameless ]][[file:S022329a072.png |120px|frameless ]]
[[file:S022329 03.gif |120px|frameless ]]
|PicoscopeImages=[[file:S022329.gif |120px|frameless ]][[file:S022329 01.gif |120px|frameless ]][[file:S022329 02.gif |120px|frameless ]][[file:S022329 03.gif |120px|frameless ]][[file:S022329 04.gif |120px|frameless ]][[file:S022329 05.gif |120px|frameless ]][[file:S022329 07.gif |120px|frameless ]][[file:S022329 08.gif |120px|frameless ]][[file:S022329 09.gif |120px|frameless ]][[file:S022329 10.gif |120px|frameless ]][[file:S022329 11.gif |120px|frameless ]][[file:S022329 12.gif |120px|frameless ]][[file:S022329 13.gif |120px|frameless ]][[file:S022329 14.gif |120px|frameless ]]
[[file:S022329 04.gif |120px|frameless ]]
}}
[[file:S022329 05.gif |120px|frameless ]]
[[file:S022329 07.gif |120px|frameless ]]
[[file:S022329 08.gif |120px|frameless ]]
[[file:S022329 09.gif |120px|frameless ]]
[[file:S022329 10.gif |120px|frameless ]]
[[file:S022329 11.gif |120px|frameless ]]
[[file:S022329 12.gif |120px|frameless ]]
[[file:S022329 13.gif |120px|frameless ]]
[[file:S022329 14.gif |120px|frameless ]]
<!-- Add picoscope links here:[[file:S022329 |120px|frameless ]] -->
<!-- [[/S022329 | Single gifs ]] -->
|
{| {{table}}  
{| {{table}}  
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
Line 152: Line 103:
|-  
|-  
|}
|}
|-
| style="background:gainsboro; color:black;" colspan="8"|
[[file:S022329a061.png |120px|frameless ]]
[[file:S022329a062.png |120px|frameless ]]
[[file:S022329a063.png |120px|frameless ]]
[[file:S022329a064.png |120px|frameless ]]
[[file:S022329a065.png |120px|frameless ]]
[[file:S022329a066.png |120px|frameless ]]
[[file:S022329a067.png |120px|frameless ]]
[[file:S022329a068.png |120px|frameless ]]
[[file:S022329a069.png |120px|frameless ]]
[[file:S022329a070.png |120px|frameless ]]
[[file:S022329a071.png |120px|frameless ]]
[[file:S022329a072.png |120px|frameless ]]
|-
| colspan="9"| .
|-
|-
! style="background:gainsboro; color:black;" rowspan="2"|27/4-2020
{{Template:ProcessRunPeg1Row
|Travka20 wafer,
|RunDate =27/4-2020
|Si /  20%
|WaferInfo =Travka20 wafer
|S022329 +1min TDESC clean
|MaterialExposed=Si /  20
|nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes
|Tool=Peg 1
|S022330
|Conditioning=S022329 +1min TDESC clean
|Resist etch rate: 59 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
|Recipe=nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes
| [[file:S022330.gif |120px|frameless ]]
|WaferID=S022330
[[file:S022330 02.gif |120px|frameless ]]
|Comments=Resist etch rate: 59 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
[[file:S022330 03.gif |120px|frameless ]]
|SEMimages=[[file:S022330a073.png |120px|frameless ]][[file:S022330a074.png |120px|frameless ]][[file:S022330a075.png |120px|frameless ]][[file:S022330a076.png |120px|frameless ]][[file:S022330a077.png |120px|frameless ]][[file:S022330a078.png |120px|frameless ]][[file:S022330a079.png |120px|frameless ]][[file:S022330a080.png |120px|frameless ]][[file:S022330a081.png |120px|frameless ]][[file:S022330a082.png |120px|frameless ]][[file:S022330a083.png |120px|frameless ]][[file:S022330a084.png |120px|frameless ]][[file:S022330a085.png |120px|frameless ]][[file:S022330a086.png |120px|frameless ]]
[[file:S022330 04.gif |120px|frameless ]]
|PicoscopeImages=[[file:S022330.gif |120px|frameless ]][[file:S022330 02.gif |120px|frameless ]][[file:S022330 03.gif |120px|frameless ]][[file:S022330 04.gif |120px|frameless ]][[file:S022330 05.gif |120px|frameless ]][[file:S022330 06.gif |120px|frameless ]][[file:S022330 07.gif |120px|frameless ]][[file:S022330 08.gif |120px|frameless ]][[file:S022330 09.gif |120px|frameless ]][[file:S022330 10.gif |120px|frameless ]][[file:S022330 12.gif |120px|frameless ]][[file:S022330 13.gif |120px|frameless ]][[file:S022330 14.gif |120px|frameless ]][[file:S022330 15.gif |120px|frameless ]]
[[file:S022330 05.gif |120px|frameless ]]
}}
[[file:S022330 06.gif |120px|frameless ]]
[[file:S022330 07.gif |120px|frameless ]]
[[file:S022330 08.gif |120px|frameless ]]
[[file:S022330 09.gif |120px|frameless ]]
[[file:S022330 10.gif |120px|frameless ]]
[[file:S022330 12.gif |120px|frameless ]]
[[file:S022330 13.gif |120px|frameless ]]
[[file:S022330 14.gif |120px|frameless ]]
[[file:S022330 15.gif |120px|frameless ]]
<!-- Add picoscope links here:[[file:S022330 |120px|frameless ]] -->
<!-- [[/S022330 | Single gifs ]] -->
|
{| {{table}}  
{| {{table}}  
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
Line 227: Line 149:
|-  
|-  
|}
|}
|-
| style="background:gainsboro; color:black;" colspan="8"|
[[file:S022330a073.png |120px|frameless ]]
[[file:S022330a074.png |120px|frameless ]]
[[file:S022330a075.png |120px|frameless ]]
[[file:S022330a076.png |120px|frameless ]]
[[file:S022330a077.png |120px|frameless ]]
[[file:S022330a078.png |120px|frameless ]]
[[file:S022330a079.png |120px|frameless ]]
[[file:S022330a080.png |120px|frameless ]]
[[file:S022330a081.png |120px|frameless ]]
[[file:S022330a082.png |120px|frameless ]]
[[file:S022330a083.png |120px|frameless ]]
[[file:S022330a084.png |120px|frameless ]]
[[file:S022330a085.png |120px|frameless ]]
[[file:S022330a086.png |120px|frameless ]]
|-
| colspan="9"| .
|-
|-
! style="background:gainsboro; color:black;" rowspan="2"|27/4-2020
{{Template:ProcessRunPeg1Row
|Travka35 wafer,
|RunDate =27/4-2020
|Si /  35%
|WaferInfo =Travka35 wafer
|S022330 +1min TDESC clean
|MaterialExposed=Si /  35%
|nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes
|Tool=Peg 1
|S022331
|Conditioning=S022330 +1min TDESC clean
|Resist etch rate: 66 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
|Recipe=nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes
| [[file:S022331.gif |120px|frameless ]]
|WaferID=S022331
[[file:S022331 01.gif |120px|frameless ]]
|Comments=Resist etch rate: 66 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
[[file:S022331 02.gif |120px|frameless ]]
|SEMimages=[[file:S022331a087.png |120px|frameless ]][[file:S022331a088.png |120px|frameless ]][[file:S022331a089.png |120px|frameless ]][[file:S022331a090.png |120px|frameless ]][[file:S022331a091.png |120px|frameless ]][[file:S022331a092.png |120px|frameless ]][[file:S022331a093.png |120px|frameless ]][[file:S022331a094.png |120px|frameless ]][[file:S022331a095.png |120px|frameless ]][[file:S022331a096.png |120px|frameless ]][[file:S022331a097.png |120px|frameless ]]
[[file:S022331 03.gif |120px|frameless ]]
|PicoscopeImages=[[file:S022331.gif |120px|frameless ]][[file:S022331 01.gif |120px|frameless ]][[file:S022331 02.gif |120px|frameless ]][[file:S022331 03.gif |120px|frameless ]][[file:S022331 04.gif |120px|frameless ]][[file:S022331 05.gif |120px|frameless ]][[file:S022331 06.gif |120px|frameless ]][[file:S022331 07.gif |120px|frameless ]][[file:S022331 08.gif |120px|frameless ]][[file:S022331 09.gif |120px|frameless ]][[file:S022331 10.gif |120px|frameless ]][[file:S022331 11.gif |120px|frameless ]][[file:S022331 12.gif |120px|frameless ]][[file:S022331 13.gif |120px|frameless ]][[file:S022331 14.gif |120px|frameless ]]
[[file:S022331 04.gif |120px|frameless ]]
}}
[[file:S022331 05.gif |120px|frameless ]]
[[file:S022331 06.gif |120px|frameless ]]
[[file:S022331 07.gif |120px|frameless ]]
[[file:S022331 08.gif |120px|frameless ]]
[[file:S022331 09.gif |120px|frameless ]]
[[file:S022331 10.gif |120px|frameless ]]
[[file:S022331 11.gif |120px|frameless ]]
[[file:S022331 12.gif |120px|frameless ]]
[[file:S022331 13.gif |120px|frameless ]]
[[file:S022331 14.gif |120px|frameless ]]
<!-- Add picoscope links here:[[file:S022331 |120px|frameless ]] -->
<!-- [[/S022331 | Single gifs ]] -->
|
{| {{table}}  
{| {{table}}  
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
Line 303: Line 193:
|-  
|-  
|}
|}
|-
| style="background:gainsboro; color:black;" colspan="8"|
[[file:S022331a087.png |120px|frameless ]]
[[file:S022331a088.png |120px|frameless ]]
[[file:S022331a089.png |120px|frameless ]]
[[file:S022331a090.png |120px|frameless ]]
[[file:S022331a091.png |120px|frameless ]]
[[file:S022331a092.png |120px|frameless ]]
[[file:S022331a093.png |120px|frameless ]]
[[file:S022331a094.png |120px|frameless ]]
[[file:S022331a095.png |120px|frameless ]]
[[file:S022331a096.png |120px|frameless ]]
[[file:S022331a097.png |120px|frameless ]]
|-
| colspan="9"| .
|-
|-
! style="background:gainsboro; color:black;" rowspan="2"|27/4-2020
{{Template:ProcessRunPeg1Row
|Travka50 wafer,
|RunDate =27/4-2020
|Si /  50%
|WaferInfo =Travka50 wafer
|S022331 +1min TDESC clean
|MaterialExposed=Si /  50%
|nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes
|Tool=Peg 1
|S022332
|Conditioning=S022331 +1min TDESC clean
|Resist etch rate: 58 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
|Recipe=nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes
| [[file:S022332.gif |120px|frameless ]]
|WaferID=S022332
[[file:S022332 01.gif |120px|frameless ]]
|Comments=Resist etch rate: 58 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
[[file:S022332 02.gif |120px|frameless ]]
|SEMimages=[[file:S022332a098.png |120px|frameless ]][[file:S022332a099.png |120px|frameless ]][[file:S022332a100.png |120px|frameless ]][[file:S022332a101.png |120px|frameless ]][[file:S022332a102.png |120px|frameless ]][[file:S022332a103.png |120px|frameless ]][[file:S022332a104.png |120px|frameless ]][[file:S022332a105.png |120px|frameless ]][[file:S022332a106.png |120px|frameless ]][[file:S022332a107.png |120px|frameless ]][[file:S022332a108.png |120px|frameless ]][[file:S022332a109.png |120px|frameless ]][[file:S022332a110.png |120px|frameless ]]
[[file:S022332 03.gif |120px|frameless ]]
|PicoscopeImages=[[file:S022332.gif |120px|frameless ]][[file:S022332 01.gif |120px|frameless ]][[file:S022332 02.gif |120px|frameless ]][[file:S022332 03.gif |120px|frameless ]][[file:S022332 04.gif |120px|frameless ]][[file:S022332 05.gif |120px|frameless ]][[file:S022332 06.gif |120px|frameless ]][[file:S022332 07.gif |120px|frameless ]][[file:S022332 08.gif |120px|frameless ]][[file:S022332 09.gif |120px|frameless ]][[file:S022332 10.gif |120px|frameless ]][[file:S022332 11.gif |120px|frameless ]][[file:S022332 12.gif |120px|frameless ]][[file:S022332 13.gif |120px|frameless ]]
[[file:S022332 04.gif |120px|frameless ]]
}}
[[file:S022332 05.gif |120px|frameless ]]
[[file:S022332 06.gif |120px|frameless ]]
[[file:S022332 07.gif |120px|frameless ]]
[[file:S022332 08.gif |120px|frameless ]]
[[file:S022332 09.gif |120px|frameless ]]
[[file:S022332 10.gif |120px|frameless ]]
[[file:S022332 11.gif |120px|frameless ]]
[[file:S022332 12.gif |120px|frameless ]]
[[file:S022332 13.gif |120px|frameless ]]
<!-- Add picoscope links here:[[file:S022332 |120px|frameless ]] -->
<!-- [[/S022332 | Single gifs ]] -->
|
{| {{table}}  
{| {{table}}  
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
Line 375: Line 237:
|-  
|-  
|}
|}
|-  
|-
| style="background:gainsboro; color:black;" colspan="8"|
{{Template:ProcessRunPeg1Row
[[file:S022332a098.png |120px|frameless ]]
|RunDate =27/4-2020
[[file:S022332a099.png |120px|frameless ]]
|WaferInfo =Travka65 wafer
[[file:S022332a100.png |120px|frameless ]]
|MaterialExposed=Si /  65%
[[file:S022332a101.png |120px|frameless ]]
|Tool=Peg 1
[[file:S022332a102.png |120px|frameless ]]
|Conditioning=S022332 +1min TDESC clean
[[file:S022332a103.png |120px|frameless ]]
|Recipe=nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes
[[file:S022332a104.png |120px|frameless ]]
|WaferID=S022333
[[file:S022332a105.png |120px|frameless ]]
|Comments=Resist etch rate: 58 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
[[file:S022332a106.png |120px|frameless ]]
|SEMimages=[[file:S022333a111.png |120px|frameless ]][[file:S022333a112.png |120px|frameless ]][[file:S022333a113.png |120px|frameless ]][[file:S022333a114.png |120px|frameless ]][[file:S022333a115.png |120px|frameless ]][[file:S022333a116.png |120px|frameless ]][[file:S022333a117.png |120px|frameless ]][[file:S022333a118.png |120px|frameless ]][[file:S022333a119.png |120px|frameless ]][[file:S022333a120.png |120px|frameless ]][[file:S022333a121.png |120px|frameless ]][[file:S022333a122.png |120px|frameless ]][[file:S022333a123.png |120px|frameless ]][[file:S022333a124.png |120px|frameless ]]
[[file:S022332a107.png |120px|frameless ]]
|PicoscopeImages=[[file:S022333.gif |120px|frameless ]][[file:S022333 01.gif |120px|frameless ]][[file:S022333 02.gif |120px|frameless ]][[file:S022333 03.gif |120px|frameless ]][[file:S022333 04.gif |120px|frameless ]][[file:S022333 05.gif |120px|frameless ]][[file:S022333 06.gif |120px|frameless ]][[file:S022333 07.gif |120px|frameless ]][[file:S022333 08.gif |120px|frameless ]][[file:S022333 09.gif |120px|frameless ]][[file:S022333 10.gif |120px|frameless ]][[file:S022333 11.gif |120px|frameless ]][[file:S022333 12.gif |120px|frameless ]][[file:S022333 13.gif |120px|frameless ]][[file:S022333 14.gif |120px|frameless ]]
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|-
| colspan="9"| .


|-
! style="background:gainsboro; color:black;" rowspan="2"|27/4-2020
|Travka65 wafer,
|Si /  65%
|S022332 +1min TDESC clean
|nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes
|S022333
|Resist etch rate: 58 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
| [[file:S022333.gif |120px|frameless ]]
[[file:S022333 01.gif |120px|frameless ]]
[[file:S022333 02.gif |120px|frameless ]]
[[file:S022333 03.gif |120px|frameless ]]
[[file:S022333 04.gif |120px|frameless ]]
[[file:S022333 05.gif |120px|frameless ]]
[[file:S022333 06.gif |120px|frameless ]]
[[file:S022333 07.gif |120px|frameless ]]
[[file:S022333 08.gif |120px|frameless ]]
[[file:S022333 09.gif |120px|frameless ]]
[[file:S022333 10.gif |120px|frameless ]]
[[file:S022333 11.gif |120px|frameless ]]
[[file:S022333 12.gif |120px|frameless ]]
[[file:S022333 13.gif |120px|frameless ]]
[[file:S022333 14.gif |120px|frameless ]]
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|
{| {{table}}  
{| {{table}}  
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
| align="center" style="background:#f0f0f0;"|'''SEM image:'''
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| colspan="9"| .
|-
|-
! style="background:gainsboro; color:black;" rowspan="2"|27/4-2020
{{Template:ProcessRunPeg1Row
|Travka80 wafer,
|RunDate =27/4-2020
|Si /  80%
|WaferInfo =Travka80 wafer
|S022333 + 1min TDESC clean
|MaterialExposed=Si /  80%
|nanolab/ jmli / DREM / DREM 2kW nano, 150 cycles or 11:00 minutes
|Tool=Peg 1
|S022334
|Conditioning=S022333 + 1min TDESC clean
|Resist etch rate: 79 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
|Recipe=nanolab/ jmli / DREM / DREM 2kW nano, 150 cycles or 11:00 minutes
| [[file:S022334.gif |120px|frameless ]]
|WaferID=S022334
[[file:S022334 01.gif |120px|frameless ]]
|Comments=Resist etch rate: 79 nm/min [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=384373 Process log entry]
[[file:S022334 02.gif |120px|frameless ]]
|SEMimages=[[file:S022334a125.png |120px|frameless ]][[file:S022334a126.png |120px|frameless ]][[file:S022334a127.png |120px|frameless ]][[file:S022334a128.png |120px|frameless ]][[file:S022334a129.png |120px|frameless ]][[file:S022334a130.png |120px|frameless ]][[file:S022334a131.png |120px|frameless ]][[file:S022334a132.png |120px|frameless ]][[file:S022334a133.png |120px|frameless ]][[file:S022334a134.png |120px|frameless ]][[file:S022334a135.png |120px|frameless ]][[file:S022334a136.png |120px|frameless ]]
[[file:S022334 03.gif |120px|frameless ]]
|PicoscopeImages= [[file:S022334.gif |120px|frameless ]][[file:S022334 01.gif |120px|frameless ]][[file:S022334 02.gif |120px|frameless ]][[file:S022334 03.gif |120px|frameless ]][[file:S022334 04.gif |120px|frameless ]][[file:S022334 05.gif |120px|frameless ]][[file:S022334 06.gif |120px|frameless ]][[file:S022334 07.gif |120px|frameless ]][[file:S022334 08.gif |120px|frameless ]][[file:S022334 09.gif |120px|frameless ]][[file:S022334 10.gif |120px|frameless ]][[file:S022334 11.gif |120px|frameless ]][[file:S022334 12.gif |120px|frameless ]][[file:S022334 13.gif |120px|frameless ]][[file:S022334 14.gif |120px|frameless ]]
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}}
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{| {{table}}  
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| align="center" style="background:#f0f0f0;"|'''SEM image:'''
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Latest revision as of 15:43, 11 November 2024


Unless otherwise stated, the content of this page was created by the dry etch group at DTU Nanolab

DREM 2kW runs on complete set of Travka 5 to 80 % wafers

DREM response to variations is trench widths and etch loads
Date Substrate information Process information
Wafer info Mask/exposed area Tool Conditioning Recipe Wafer ID Comments
27/4-2020 Travka05 wafer Si / 5% Peg 1 S022327 DREM 2kW RF MU runs nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes S022328 Resist etch rate: 62 nm/min Process log entry
SEM image: a060 a059 a058 a057 a056 a055 a054 a053 a052 a051 a050 a049
Trench width (um) 2.08 3.1 4.2 6.08 10.22 15.27 25.26 39.7 50.5 99.82 150.09 299.56
Etched depth (um) 22.96 27.05 28.46 31.57 35.48 37.96 40.7 42.39 43.24 44.09 44.54 44.56
Etch rate (um/min) 2.09 2.46 2.59 2.87 3.23 3.45 3.7 3.85 3.93 4.01 4.05 4.05
Etch rate (nm/cyc) 153 180 190 210 237 253 271 283 288 294 297 297
Sidewall bowing (%) 0.1 0.6 0.2 0.6 0.1 0.2 -0.1 0.2 -0.4 -0.3 -0.3 -1.1
Sidewall angle (degs) 90.85 90.98 90.94 91.18 91.45 91.4 91.68 92.02 91.78 92.3 92.53 92.35
Bottom bowing (%) 16.93 14.87 20.32 20.1 19.02 17.6 14.71 13.78 10.7 6.84 4.53 2.34
Aspect ratio 9.5 7.61 6.12 4.71 3.2 2.35 1.54 1.03 0.84 0.43 0.29 0.15
27/4-2020 Travka10 wafer, Si / 10% Peg 1 S022328 +1min TDESC clean nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes S022329 Resist etch rate: 60 nm/min Process log entry
SEM image: a061 a062 a063 a064 a065 a066 a067 a068 a069 a070 a071 a072
Trench width (um) 1.78 2.88 4.24 5.78 10.22 15.36 25.48 40.51 75.63 100.86 200.75 299.63
Etched depth (um) 21.26 24.82 27.54 31.1 35.34 38.21 41.17 42.98 44.58 45.15 45.16 44.68
Etch rate (um/min) 1.93 2.26 2.5 2.83 3.21 3.47 3.74 3.91 4.05 4.1 4.11 4.06
Etch rate (nm/cyc) 142 165 184 207 236 255 274 287 297 301 301 298
Sidewall bowing (%) -0.2 0.2 -0.1 0.2 -0.2 -0.4 -0.2 -0.8 -0.6 -0.7 -1.3 -1.4
Sidewall angle (degs) 90.47 90.61 90.35 90.98 90.78 91.08 91.11 91.43 91.97 91.55 92.07 92.37
Bottom bowing (%) 26.03 15.16 18.16 17.1 17.51 17.21 15.48 13.54 8.58 6.93 3.43 2.43
Aspect ratio 10.89 7.92 6.26 4.94 3.31 2.38 1.57 1.04 0.58 0.44 0.22 0.15
27/4-2020 Travka20 wafer Si / 20 Peg 1 S022329 +1min TDESC clean nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes S022330 Resist etch rate: 59 nm/min Process log entry
SEM image: a086 a085 a084 a083 a082 a081 a080 a078 a077 a076 a075 a074 a073
Trench width (um) 1.91 3.04 3.68 5.89 10.08 15.02 40.03 49.99 75.51 100.03 148.99 199.75 298.84
Etched depth (um) 21.58 24.69 26.33 29.81 33.68 36.25 40.32 40.95 41.68 41.77 41.84 42.1 41.82
Etch rate (um/min) 1.96 2.24 2.39 2.71 3.06 3.3 3.67 3.72 3.79 3.8 3.8 3.83 3.8
Etch rate (nm/cyc) 144 165 176 199 225 242 269 273 278 278 279 281 279
Sidewall bowing (%) 0.2 0.4 0.3 0.4 0.4 0.1 -0.1 -0.5 -0.6 -0.5 -0.6 -0.8 -0.3
Sidewall angle (degs) 90.77 90.91 90.93 91.14 91.39 91.49 91.66 91.91 91.96 92.38 92.57 92.96 93.05
Bottom bowing (%) 23.69 15.29 19.28 16.95 17.41 17.41 12.51 11.52 8.37 6.7 4.3 3.23 2.03
Aspect ratio 9.8 7.2 6.42 4.6 3.1 2.28 0.98 0.8 0.54 0.41 0.28 0.21 0.14
27/4-2020 Travka35 wafer Si / 35% Peg 1 S022330 +1min TDESC clean nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes S022331 Resist etch rate: 66 nm/min Process log entry
SEM image: a087 a088 a089 a090 a091 a092 a093 a094 a095 a096 a097
Trench width (um) 1.61 2.71 3.71 7.69 9.87 15.04 25.1 40.03 75.03 199.26 299.66
Etched depth (um) 18.41 22.24 24.41 29.54 31.11 33.55 35.77 37.1 37.96 38.18 38.24
Etch rate (um/min) 1.67 2.02 2.22 2.69 2.83 3.05 3.25 3.37 3.45 3.47 3.48
Etch rate (nm/cyc) 123 148 163 197 207 224 238 247 253 255 255
Sidewall bowing (%) -0.2 0.1 0.1 0.4 0.2 0.1 -0.3 -0.2 -0.5 -1.1 -1.2
Sidewall angle (degs) 90.33 90.75 90.89 91.13 91.07 91.31 91.34 91.69 91.84 92.49 92.44
Bottom bowing (%) 24.26 20.15 19.99 19.05 17.3 16.29 16.68 13.21 7.68 3.61 2.18
Aspect ratio 10.7 7.42 5.99 3.58 2.98 2.13 1.38 0.9 0.5 0.19 0.13
27/4-2020 Travka50 wafer Si / 50% Peg 1 S022331 +1min TDESC clean nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes S022332 Resist etch rate: 58 nm/min Process log entry
SEM image: a110 a109 a108 a107 a106 a105 a103 a102 a101 a099 a098
Trench width (um) 1.69 2.57 3.68 7.62 14.53 39.96 49.94 100.08 199.63 298.35 299.12
Etched depth (um) 17.88 20.47 22.58 27.07 30.78 33.82 34.11 34.67 34.66 34.26 34.54
Etch rate (um/min) 1.63 1.86 2.05 2.46 2.8 3.07 3.1 3.15 3.15 3.11 3.14
Etch rate (nm/cyc) 119 136 151 180 205 225 227 231 231 228 230
Sidewall bowing (%) 0.1 0.1 0.1 0.2 0.2 -0.5 -0.3 -0.8 -0.7 -2 -1.5
Sidewall angle (degs) 90.58 90.8 90.9 91.17 91.56 91.68 91.62 92.08 92.15 93.34 92.48
Bottom bowing (%) 24.2 20.91 19.84 16.14 17.61 12.38 10.43 5.77 3.26 1.83 1.96
Aspect ratio 9.58 7.18 5.61 3.32 2.01 0.83 0.67 0.34 0.17 0.11 0.11
27/4-2020 Travka65 wafer Si / 65% Peg 1 S022332 +1min TDESC clean nanolab/ jmli / DREM / DREM 2kW, 150 cycles or 11:00 minutes S022333 Resist etch rate: 58 nm/min Process log entry
SEM image: a111 a112 a113 a114 a115 a116 a117 a118 a119 a120 a121 a122 a123 a124
Trench width (um) 2.5 3.42 5.44 7.37 9.37 14.4 24.44 39.54 74.69 100.04 150.41 199.78 299.94 301.31
Etched depth (um) 18.9 20.55 23.1 24.82 26.16 28.28 30.04 31.02 31.45 30.89 31.28 30.52 31.47 31.59
Etch rate (um/min) 1.72 1.87 2.1 2.26 2.38 2.57 2.73 2.82 2.86 2.81 2.84 2.77 2.86 2.87
Etch rate (nm/cyc) 126 137 154 165 174 189 200 207 210 206 209 203 210 211
Sidewall bowing (%) 0 0.1 0.2 0.1 0.2 0.4 0.2 -0.3 -0.7 -1.4 -0.7 -0.8 -0.9 -1
Sidewall angle (degs) 90.75 90.75 90.96 91.03 91.19 91.48 91.42 91.86 91.99 91.88 91.81 92.79 92.54 92.34
Bottom bowing (%) 18.3 18.42 16.33 16.3 16.79 18.16 14.77 11.67 6.69 4.18 3.28 1.66 1.42 1.93
Aspect ratio 6.89 5.58 3.97 3.18 2.64 1.87 1.2 0.77 0.42 0.31 0.21 0.15 0.1 0.1
27/4-2020 Travka80 wafer Si / 80% Peg 1 S022333 + 1min TDESC clean nanolab/ jmli / DREM / DREM 2kW nano, 150 cycles or 11:00 minutes S022334 Resist etch rate: 79 nm/min Process log entry
SEM image: a136 a135 a134 a133 a126 a125 a132 a131 a130 a129 a128 a127
Trench width (um) 5.51 9.61 14.79 24.6 24.8 25.02 49.42 74.63 99.55 199.49 299.49 299.54
Etched depth (um) 21.45 24.21 25.99 27.45 27.15 27.35 28.03 28.38 28.48 28.23 28.52 29.16
Etch rate (um/min) 1.95 2.2 2.36 2.5 2.47 2.49 2.55 2.58 2.59 2.57 2.59 2.65
Etch rate (nm/cyc) 143 161 173 183 181 182 187 189 190 188 190 194
Sidewall bowing (%) 0.4 0.4 0.3 -0.3 -0.1 -0.6 -0.6 -0.7 -0.5 -1 -0.3 -1.2
Sidewall angle (degs) 90.95 91.1 91.34 91.44 91.19 91.14 91.35 91.86 91.65 92.32 91.7 92.54
Bottom bowing (%) 13.55 16.66 16.02 14.8 13.59 14.6 8.88 5.86 4.36 2.14 1.84 1.96
Aspect ratio 3.66 2.41 1.69 1.09 1.07 1.07 0.56 0.38 0.28 0.14 0.09 0.1


Plots

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