Specific Process Knowledge/Lithography/Coaters/GammaEbeam: Difference between revisions
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The 2" coater station is equipped with 1 resist line, as well as 1 syringe line: | The 2" coater station is equipped with 1 resist line, as well as 1 syringe line: | ||
*AR-P 6200.09 (CSAR) | *AR-P 6200.09 (CSAR) | ||
*Syringe, which can be used for various resists (anisole-based or PGMEA-based). | *Syringe, which can be used for various resists (anisole-based or PGMEA-based). ''We currently recommend against using the syringe, as the process setup is quite demanding. Use a manual spin coater instead.'' | ||
The 4"/6" coater station is equipped with 4 different resists lines: | The 4"/6" coater station is equipped with 4 different resists lines: | ||
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*AZ 4562 | *AZ 4562 | ||
The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and | The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and ''requires'' batch processing - it is not for processing a few wafers now and then. | ||
Link to information about [[Specific_Process_Knowledge/Pattern_Design#Helpful_information_for_chip_layout|coater chuck size and hotplate pin positions]]. | |||
'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]''' | '''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]''' | ||
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*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information|General Process information]] | *[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information|General Process information]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control_(QC)|Quality Control (QC)]] | *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control_(QC)|Quality Control (QC)]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes|Standard Processes | *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes|Standard Processes]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Syringe_Processes|Syringe Processes]] | *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Syringe_Processes|Syringe Processes]] | ||
=== Equipment performance and process related parameters === | === Equipment performance and process related parameters === | ||
{| border=" | {|border="1" cellspacing="1" cellpadding="10" style="text-align:left;" | ||
!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||