Jump to content

Specific Process Knowledge/Lithography/Coaters/GammaEbeam: Difference between revisions

← Older edit
VisualWikitext
Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,931 edits
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,530 edits
 
(5 intermediate revisions by 2 users not shown)
Line 7: Line 7:
The 2" coater station is equipped with 1 resist line, as well as 1 syringe line:
The 2" coater station is equipped with 1 resist line, as well as 1 syringe line:
*AR-P 6200.09 (CSAR)
*AR-P 6200.09 (CSAR)
*Syringe, which can be used for various resists (anisole-based or PGMEA-based).
*Syringe, which can be used for various resists (anisole-based or PGMEA-based). ''We currently recommend against using the syringe, as the process setup is quite demanding. Use a manual spin coater instead.''
 


The 4"/6" coater station is equipped with 4 different resists lines:  
The 4"/6" coater station is equipped with 4 different resists lines:  
Line 15: Line 16:
*AZ 4562   
*AZ 4562   


The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers.
The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and ''requires'' batch processing - it is not for processing a few wafers now and then.
 
Link to information about [[Specific_Process_Knowledge/Pattern_Design#Helpful_information_for_chip_layout|coater chuck size and hotplate pin positions]].


'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''
'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''
Line 24: Line 27:
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information|General Process information]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information|General Process information]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control_(QC)|Quality Control (QC)]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control_(QC)|Quality Control (QC)]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes|Standard Processes:]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes|Standard Processes]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Syringe_Processes|Syringe Processes]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Syringe_Processes|Syringe Processes]]


=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===


{| border="2" cellspacing="0" cellpadding="2"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  


!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
Line 52: Line 55:
|style="background:LightGrey; color:black"|HMDS contact angle
|style="background:LightGrey; color:black"|HMDS contact angle
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
60 - 80° (on Silicon)
  60 - 80° (on Silicon)
|-
|-
|style="background:LightGrey; color:black"|Coating thickness
|style="background:LightGrey; color:black"|Coating thickness
Line 64: Line 67:
|style="background:LightGrey; color:black"|Priming temperature
|style="background:LightGrey; color:black"|Priming temperature
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
120 °C
  120 °C
|-
|-
|style="background:LightGrey; color:black"|Spin speed
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
10 - 6000 rpm
  10 - 6000 rpm
|-
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
10 - 10000 rpm/s
  10 - 10000 rpm/s
|-
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
25 - 200 °C
  25 - 200 °C
|-
|-
|style="background:LightGrey; color:black"|Cool plate temperature
|style="background:LightGrey; color:black"|Cool plate temperature
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
21 °C
  21 °C
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
Line 91: Line 94:
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Silicon, III-V, and glass
  Silicon, III-V, and glass


Resists and crystalbond are not allowed in the HMDS module
  Resists and crystalbond are not allowed in the HMDS module
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
1 - 25  
  1 - 25  
|-  
|-  
|}
|}


<br clear="all" />
<br clear="all" />
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam"