Specific Process Knowledge/Characterization/XRD

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XRD at DTU Nanolab

We have two X-ray diffraction setups in building 346:

• The XRD SmartLab primarily for thin film analysis inside the cleanroom.
• The XRD SmartLab 9kW Rotating Anode multipurpose system outside the cleanroom.
• The XRD Powder for phase analysis of powders outside the cleanroom.

Experiments performed with XRD

• List and description of possible XRD measurements with typical setup requirements Note mostly relevant for XRD Smartlab

Data analysis

For data analysis, we recommend using Rigaku SmartLab Studio for both thinfilms and basic powder analysis. If more advanced powder analysis is needed we provide access to a remote desktop with a licence for the excellent Malvern Panalytical software, HighScore.

• Installing SmartLab Studio II
• Converting data from XRD Powder to SmartLab Studio II
• Guide for using SmartLab Studio II for data analysis
• Guide for using HighScore Plus for advanced powder data analysis

Apart from this commercial software a wide range of free software is available online for data analysis. Here are some suggestions from MIT.

Comparison of the XRDs at Nanolab

Equipment		XRD SmartLab	XRD SmartLab 9kW Rotating Anode	XRD Powder
Purpose	Crystal structure analysis and thin film thickness measurement	Phase ID Crystal Size Crystallinity Quality and degree of orientation 3D orientation Latice strain Composition Twist 3D lattice constant Thickness Roughness Density	Phase ID Crystal Size Crystallinity Quality and degree of orientation 3D orientation Latice strain Composition Twist 3D lattice constant Thickness Roughness Density	Phase ID Crystal Size Crystallinity
X-ray generator	Maximum rated output	3 kW	9 kW	600 W
	Rated tube voltage	20 to 45 kV	20 to 45 kV	40 kV
	Rated tube current	2 to 60 mA	2 to 200 mA	15 mA
	Type	Sealed tube	Rotating Anode	Sealed tube
	Target	Cu	Cu	Cu
	Focus size	0.4 mm x 8 mm (Line/Point)	0.1-0.5 mm x 8 mm (Line/Point)	0.4 mm x 12 mm (Line)
Goniometer	Scanning mode	incident / receiver coupled or independent	incident / receiver coupled or independent	incident / receiver coupled
	Goniomenter radius	300 mm	300 mm	145 mm
	Minimum step size	0.0001° (0.36")	0.0001° (0.36")	0.001° (3.6")
	Sample stage motion	χ:-5~+95° φ:0~360° Z:-4~+1 mm X,Y:±50 mm for a 100 mm wafer Rx,Ry:-5~+5°	χ:-5~+95° φ:0~360° Z:-4~+1 mm X,Y:±50 mm for a 100 mm wafer Rx,Ry:-5~+5°	Fixed with rotation
Optics	Incident side	Cross Beam Optics(CBO) Ge(220)x2 monochromator In-Plane Parallel Slit Collimator (PSC) Soller slit Automatic variable divergence slit Length limiting slits	Cross Beam Optics(CBO) Ge(400)x2 monochromator In-Plane Parallel Slit Collimator (PSC) Soller slit Automatic variable divergence slit Length limiting slits	0.04° soller slit Ni and Cu filter Divergence slits Beam masks
	Receiver side	Automatic variable scattering slit Automatic variable receiver slit Parallel slit analysers (PSA) Ge(220)x2 analyser	Automatic variable scattering slit Automatic variable receiver slit Parallel slit analysers (PSA) Ge(400)x2 analyser	0.04° soller slit Ni filter
Substrates	Measurement temperature	Room temperature	Room temperature	May be heated in N2 up to 500°C
	Substrate size	up to 150 mm wafers Thickness max 21 mm	up to 150 mm wafers Thickness max 21 mm	Only for powders
	Allowed materials	All materials approved in the cleanroom. No powders or dusty materials.	All materials have to be approved	All materials have to be approved