Latest revision as of 15:53, 3 July 2025

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here

Back-end processing

Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Note! The SupportLab (former Packlab) has been established and tools are currently relocated. Please note that the training on machines requires the "Introduction course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information.

Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.

Choose an equipment

Chip/die mounting
- Die Bonder (eutectic metal)

Wire bonding
- TPT Wire Bonder
- Ball Wire Bonder

Wafer Dicing and Machining

Pick & place
- Micro transfer printer

Choose processing method

Lapping/polishing	Cutting/cleaving	Milling	Die bonding	Wire bonding
Polisher/Lapper machine	Diamond Pen (Wafer Scriber) LatticeAxe FlipScribe FlexScribe Dicing Saw Disco DAD 321 (old saw) Dicing Saw Disco DAD 3241 (new saw 2021) Laser Micromachining Tool	Laser Micromachining Tool	Die Bonder (eutectic metal)	TPT Wire Bonder Ball Wire Bonder

@@ Line 1: / Line 1: @@
-<!-- Under construction [[Image:section under construction.jpg|70px]] -->
+{{cc-nanolab}}
 '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''
+=Back-end processing=
 Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
 These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
+<BR>
-[[Image:section under construction.jpg|70px|right]]
+<BR>
-{| {{table} style="background:LightGray"}
+{|style="background:LightGray"}
-! '''Note! Packlab will be closed from February/March 2023 to Q2 2024 due to the construction of our new PolyFabLab.'''
+! '''Note! The SupportLab (former Packlab) has been established and tools are currently relocated.'''
-|-
+<br>
-| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.
+Please note that the training on machines requires the "Introduction course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information.
 |-
 |}
 <br clear="all">
 Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.
@@ Line 19: / Line 22: @@
 == Choose an equipment ==
-* Stylus profilometer measurements
-**[[Specific Process Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
 * Chip/die mounting
 **[[/Die Bonder|Die Bonder (eutectic metal)]]
+<br>
 *Wire bonding
 **[[/Wire Bonder|TPT Wire Bonder]]
 **[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
-*Wafer dicing/machining
+<br>
+*Wafer Dicing and Machining
 **[[/Polisher CMP|Polisher CMP - located in the cleanroom]]
 **[[/Polishing machine|Polisher/Lapper machine]]
 **[[/LatticeAxe|LatticeAxe]]
 **[[/FlipScribe|FlipScribe]]
 **[[/FlexScribe|FlexScribe]]
-**[[/Wafer Scriber|Wafer Scriber]]
+**Wafer Scriber
 **[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
 **[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
 **[[/Disco Saw|Wafer cleaner DCS 1441 (post dicing)]]
 **[[/Laser Micromachining Tool|Laser Micromachining Tool]]
-*Molding
+<br>
-**[[/Polymer Injection Molder|Polymer Injection Molder]]
+*Pick & place
-**[[/Hot Embosser|Hot Embosser]]
+**[[/Micro transfer printer|Micro transfer printer]]
 <!--
 * X-ray inspection system
@@ Line 48: / Line 52: @@
 {| {{table}}
 | align="left" valign="top" style="background:LightGray"|''' Lapping/polishing'''
-| align="left" valign="top"  style="background:LightGray"|''' Cutting'''
+| align="left" valign="top"  style="background:LightGray"|''' Cutting/cleaving'''
 | align="left" valign="top" style="background:#DCDCDC;"|''' Milling'''
 | align="left" valign="top" style="background:LightGray"|''' Die bonding'''
@@ Line 56: / Line 60: @@
 *[[/Polishing machine|Polisher/Lapper machine]]
 |style="background: LightGray"|
-*[[/Wafer Scriber|Wafer Scriber]]
+*Diamond Pen (Wafer Scriber)
 *[[/LatticeAxe|LatticeAxe]]
 *[[/FlipScribe|FlipScribe]]
@@ Line 68: / Line 72: @@
 |style="background: LightGray"|
 *[[/Die Bonder|Die Bonder (eutectic metal)]]
-*[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]]
+<!-- *[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] -->
 |style="background: LightGray"|
 *[[/Wire Bonder|TPT Wire Bonder]]