Latest revision as of 15:53, 3 July 2025

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Back-end processing

Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Note! The SupportLab (former Packlab) has been established and tools are currently relocated. Please note that the training on machines requires the "Introduction course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information.

Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.

Choose an equipment

Chip/die mounting
- Die Bonder (eutectic metal)

Wire bonding
- TPT Wire Bonder
- Ball Wire Bonder

Wafer Dicing and Machining

Pick & place
- Micro transfer printer

Choose processing method

Lapping/polishing	Cutting/cleaving	Milling	Die bonding	Wire bonding
Polisher/Lapper machine	Diamond Pen (Wafer Scriber) LatticeAxe FlipScribe FlexScribe Dicing Saw Disco DAD 321 (old saw) Dicing Saw Disco DAD 3241 (new saw 2021) Laser Micromachining Tool	Laser Micromachining Tool	Die Bonder (eutectic metal)	TPT Wire Bonder Ball Wire Bonder

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+{{cc-nanolab}}
 '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''
+=Back-end processing=
 Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
 These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
+<BR>
+<BR>
+{|style="background:LightGray"}
+! '''Note! The SupportLab (former Packlab) has been established and tools are currently relocated.'''
+<br>
+Please note that the training on machines requires the "Introduction course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information.
+|-
+|}
+<br clear="all">
 Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.
 == Choose an equipment ==
-* Stylus profilometer measurements
-**[[Specific Process Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
-* Substrate/chip/die cleaning
-**[[/Packlab Plasma Asher Pico 2|Packlab Plasma Asher Pico 2]]
 * Chip/die mounting
 **[[/Die Bonder|Die Bonder (eutectic metal)]]
-**[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]]
+<br>
 *Wire bonding
 **[[/Wire Bonder|TPT Wire Bonder]]
 **[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
-*Wafer dicing/machining
+<br>
+*Wafer Dicing and Machining
 **[[/Polisher CMP|Polisher CMP - located in the cleanroom]]
 **[[/Polishing machine|Polisher/Lapper machine]]
 **[[/LatticeAxe|LatticeAxe]]
 **[[/FlipScribe|FlipScribe]]
 **[[/FlexScribe|FlexScribe]]
-**[[/Wafer Scriber|Wafer Scriber]]
+**Wafer Scriber
-**[[/Disco Saw|Disco Saw]]
+**[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
+**[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
+**[[/Disco Saw|Wafer cleaner DCS 1441 (post dicing)]]
 **[[/Laser Micromachining Tool|Laser Micromachining Tool]]
-*Molding
+<br>
-**[[/Polymer Injection Molder|Polymer Injection Molder]]
+*Pick & place
-**[[/Hot Embosser|Hot Embosser]]
+**[[/Micro transfer printer|Micro transfer printer]]
+<!--
 * X-ray inspection system
 **[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]]
+ -->
 == Choose processing method ==
 {| {{table}}
 | align="left" valign="top" style="background:LightGray"|''' Lapping/polishing'''
-| align="left" valign="top"  style="background:LightGray"|''' Cutting'''
+| align="left" valign="top"  style="background:LightGray"|''' Cutting/cleaving'''
 | align="left" valign="top" style="background:#DCDCDC;"|''' Milling'''
 | align="left" valign="top" style="background:LightGray"|''' Die bonding'''
@@ Line 45: / Line 60: @@
 *[[/Polishing machine|Polisher/Lapper machine]]
 |style="background: LightGray"|
-*[[/Wafer Scriber|Wafer Scriber]]
+*Diamond Pen (Wafer Scriber)
 *[[/LatticeAxe|LatticeAxe]]
-*[[/Disco Saw|Disco Saw]]
+*[[/FlipScribe|FlipScribe]]
+*[[/FlexScribe|FlexScribe]]
+*[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
+*[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
 *[[/Laser Micromachining Tool|Laser Micromachining Tool]]
 |style="background: LightGray"|
 *[[/Laser Micromachining Tool|Laser Micromachining Tool]]
-*[https://www.inside.dtu.dk/en/medarbejder/institutter/dtu-nanotech Nanotech milling lab]
+<!-- *[https://www.inside.dtu.dk/en/medarbejder/institutter/dtu-nanotech Nanotech milling lab] -->
 |style="background: LightGray"|
 *[[/Die Bonder|Die Bonder (eutectic metal)]]
-*[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]]
+<!-- *[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] -->
 |style="background: LightGray"|
 *[[/Wire Bonder|TPT Wire Bonder]]