Specific Process Knowledge/Thermal Process/A1 Bor Drive-in furnace: Difference between revisions

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'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/A1_Bor_Drive-in_furnace click here]'''
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''This page is written by DTU Nanolab  internal''


[[Category: Equipment |Thermal A1]]
[[Category: Equipment |Thermal A1]]
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==Boron Drive-in + Pre-dep furnace (A1)==
==Boron Drive-in and Pre-dep furnace (A1)==
[[Image:A1.JPG|thumb|300x300px|Boron Drive-in and Pre-dep furnace (A1). Positioned in cleanroom B-1]]
[[Image:A1.JPG|thumb|400x400px|Boron Drive-in and Pre-dep furnace (A1). Positioned in cleanroom B-1/ Photo: DTU Nanolab internal]]


The Boron Drive-in + Pre-dep furnace (A1) is a Tempress horizontal furnace for thermal oxidation of silicon wafers. Also boron pre-deposition/doping is done furnace. Furthermore, the furnace is used for boron drive-in after the pre-deposition or boron ion implantation.
The Boron Drive-in and Pre-dep furnace (A1) is a Tempress horizontal furnace for thermal oxidation of silicon wafers. Also boron pre-deposition/doping is done in this furnace. Furthermore, the furnace is used for boron drive-in after the pre-deposition or after boron ion implantation.


The furnace is mostly used for wet and dry thermal oxidation of silicon wafers. The oxidation recipes are named e.g. "WET1000" and "DRY1000", where "WET" or "DRY" indicates whether it is a wet or dry oxidation process, and the number indicates the oxidation temperature. These processes can also be used to oxidize boron phase layers created in a pre-deposition/doping process, but this is normally not necessary, if argon is used instead of nitrogen (for pre-depositions at temperatures higher then 1050 C).
The furnace is mostly used for wet and dry thermal oxidation of silicon wafers. The oxidation recipes are named e.g. "WET1000" and "DRY1000", where "WET" or "DRY" indicates whether it is a wet or dry oxidation process, and the number indicates the oxidation temperature.  


The purpose of the boron doping is to make conductive structures, etch stop layers etc. For the pre-deposition process boron-nitride source wafers are used as the doping source to dope silicon wafers. There are only a few source wafers available, i.e. it is not possible to doped an entire batch of 30 wafers, but both sides of the source wafers are available for doping. It is necessary to activate the source wafers before use by heating them for 1 hour at the temperature needed during the pre-deposition (but never at a temperatures lower than 1050 C). During the pre-deposition a boron phase layer is created on the silicon wafers. This layer can be removed in BHF if the wafers are oxidised in the furnace after the pre-deposition.  
The purpose of the boron doping is to make conductive structures, etch stop layers etc. For pre-deposition of silicon wafers, boron-nitride source wafers are used as doping source. There are only a few source wafers available, i.e. it is not possible to dope an entire batch of 30 wafers, but both sides of the source wafers are available for doping. It is necessary to activate the source wafers before use by heating them for 1 hour at the temperature needed during the pre-deposition (but never at a temperatures lower than 1050 C). During the pre-deposition a boron phase layer is created on the silicon wafers. This layer can be removed in BHF, if argon is used instead of nitrogen for the pre-deposition (at temperatures higher then 1050 C), otherwise the wafers have to be oxidized before the BHF etch. When the boron phase layer has been removed, the wafers can go directly into the furnace again for a drive-in process with or without an oxide growth.
 
The Boron Drive-in and Pre-dep furnace is the top furnace tube in the furnace A-stack positioned in cleanroom B-1. The furnaces in the A-stack are the cleanest of all furnaces in the cleanroom. Please be aware of that all wafers have to be RCA cleaned before they enter the furnace, and please check the cross contamination information in LabManager, before you use the furnace. Before boron pre-deposition, also the source wafers and a dedicated carbide boat have to be RCA cleaned.


The Boron Drive-in + Pre-dep furnace is the top furnace tube in the A-stack positioned in cleanroom B-1. The furnaces in the A-stack are the cleanest of all furnaces in the cleanroom. Please be aware of that all wafers have to be RCA cleaned before they enter the furnace, and check the cross contamination information in LabManager before you use the furnace.


'''The user manual, quality control instruction and results, technical information and contact information can be found in LabManager:'''
'''The user manual, quality control instruction and results, technical information and contact information can be found in LabManager:'''


'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=47 Boron Drive-in + Pre-dep furnace (A1)]'''
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=47 Boron Drive-in and Pre-dep furnace (A1)]'''


==Process knowledge==
==Process knowledge==
*Oxidation: look at the [[Specific Process Knowledge/Thermal Process/Oxidation|Oxidation]] page
*Boron drive-in: look at the [[Specific Process Knowledge/Thermal Process/Dope with Boron|Dope with Boron]] page  
*Boron drive-in: look at the [[Specific Process Knowledge/Thermal Process/Dope with Boron|Dope with Boron]] page  
*Oxidation: look at the [[Specific Process Knowledge/Thermal Process/Oxidation|Oxidation]] page
*Annealing: look at the [[Specific Process Knowledge/Thermal Process/Annealing|Annealing]] page
*Boron doping: look at the [[Specific Process Knowledge/Thermal Process/Dope with Boron|'''Dope with Boron''']] page.
*Boron doping: look at the [[Specific Process Knowledge/Thermal Process/Dope with Boron|'''Dope with Boron''']] page.
<br clear="all" />
<br clear="all" />
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! QC Recipe:
! QC Recipe:
! Wet1050
! WET1050 
! Dry1050
! DRY1050 
|-  
|-  
| H<sub>2</sub> flow
| H<sub>2</sub> flow
Line 54: Line 56:
|-  
|-  
|Temperature
|Temperature
|1050 C
|1050 <sup>o</sup>C
|1050 C
|1050 <sup>o</sup>C
|-
|-
|Oxidation time
|Oxidation time
Line 70: Line 72:
and over the boat)  
and over the boat)  
|-
|-
!Dry1050
!DRY1050
|108-114 nm
|107.3 nm - 113.3 nm
|3 %
|3.2 %
|-
|-
!Wet1050
!WET1050
|286-302 nm
|298.2 nm - 305.5 nm
|5 %
|3.7 %
|-
|-
|}
|}
|-
|-
|}
|}
Numbers from March 2020
|}
|}


==Overview of the performance of the Boron Drive-in + Pre-dep furnace and some process related parameters==
 
==Overview of the performance of the Boron Drive-in and Pre-dep furnace and some process related parameters==


{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  
Line 89: Line 93:
!style="background:silver; color:black;" align="center"|Purpose  
!style="background:silver; color:black;" align="center"|Purpose  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
*Drive-in of boron
*Thermal oxidation of Si wafers
*Oxidation of silicon
*Boron pre-deposition/doping of Si wafers
*Oxidation of boron phase layers
*Oxidation of boron phase layers  
*Annealing of the oxide
*Driving-in pre-deposited or ion-implanted boron
*Boron pre-depostion using source wafer
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Annealing:
Thermal oxidation:
*Using N<sub>2</sub>
Oxidation:
*Dry oxidation using O<sub>2</sub>
*Dry oxidation using O<sub>2</sub>
*Wet oxidation using H<sub>2</sub>O generated by a torch
*Wet oxidation using H<sub>2</sub>O vapour
Boron pre-deposition/doping:
*Boron-nitride wafers are used as doping source. This is a solid doping source containing B<sub>2</sub>O<sub>3</sub> 
Driving-in pre-deposited or ion-implanted boron
*Dry or wet oxidation recipes are normally used for this purpose
|-
|-
!style="background:silver; color:black" align="center"|Performance
!style="background:silver; color:black" align="center"|Performance
|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"|
*Dry oxide: 50 Å  to ~2000 Å (it takes too long to grow a thicker oxide)
*Dry oxide: ~ 0 nm - 300 nm (it takes too long to grow a thicker oxide)
*Wet oxide: 50 Å to ~3 µm (it takes too long to grow a thicker oxide)
*Wet oxide: ~ 0 nm - 3 µm (23 hours wet oxidation at 1100 <sup>o</sup>C for Si[100] wafers)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
Line 113: Line 118:
|style="background:LightGrey; color:black"|Process pressure
|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 atm
*1 atm (no vacuum)
|-
|-
|style="background:LightGrey; color:black"|Gasses on the system
|style="background:LightGrey; color:black"|Gasses on the system
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
 
*N<sub>2</sub>
*O<sub>2</sub>, N<sub>2</sub> and H<sub>2</sub>
*O<sub>2</sub>
*H<sub>2</sub> (in a torch, H<sub>2</sub> and O<sub>2</sub> burns into H<sub>2</sub>O vapour for wet oxidation)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon wafers (RCA cleaned)
*Silicon wafers (RCA cleaned)
*Boron-nitride source wafers for boron pre-deposition/doping
|-  
|-  
|}
|}

Latest revision as of 13:40, 31 January 2023

Feedback to this page: click here

This page is written by DTU Nanolab internal


Boron Drive-in and Pre-dep furnace (A1)

Boron Drive-in and Pre-dep furnace (A1). Positioned in cleanroom B-1/ Photo: DTU Nanolab internal

The Boron Drive-in and Pre-dep furnace (A1) is a Tempress horizontal furnace for thermal oxidation of silicon wafers. Also boron pre-deposition/doping is done in this furnace. Furthermore, the furnace is used for boron drive-in after the pre-deposition or after boron ion implantation.

The furnace is mostly used for wet and dry thermal oxidation of silicon wafers. The oxidation recipes are named e.g. "WET1000" and "DRY1000", where "WET" or "DRY" indicates whether it is a wet or dry oxidation process, and the number indicates the oxidation temperature.

The purpose of the boron doping is to make conductive structures, etch stop layers etc. For pre-deposition of silicon wafers, boron-nitride source wafers are used as doping source. There are only a few source wafers available, i.e. it is not possible to dope an entire batch of 30 wafers, but both sides of the source wafers are available for doping. It is necessary to activate the source wafers before use by heating them for 1 hour at the temperature needed during the pre-deposition (but never at a temperatures lower than 1050 C). During the pre-deposition a boron phase layer is created on the silicon wafers. This layer can be removed in BHF, if argon is used instead of nitrogen for the pre-deposition (at temperatures higher then 1050 C), otherwise the wafers have to be oxidized before the BHF etch. When the boron phase layer has been removed, the wafers can go directly into the furnace again for a drive-in process with or without an oxide growth.

The Boron Drive-in and Pre-dep furnace is the top furnace tube in the furnace A-stack positioned in cleanroom B-1. The furnaces in the A-stack are the cleanest of all furnaces in the cleanroom. Please be aware of that all wafers have to be RCA cleaned before they enter the furnace, and please check the cross contamination information in LabManager, before you use the furnace. Before boron pre-deposition, also the source wafers and a dedicated carbide boat have to be RCA cleaned.


The user manual, quality control instruction and results, technical information and contact information can be found in LabManager:

Boron Drive-in and Pre-dep furnace (A1)

Process knowledge


Quality Control - Parameters and Limits

Quality control (QC) for the processes "Wet1050" and "Dry1050"
QC Recipe: WET1050 DRY1050
H2 flow 3 slm 0 slm
O2 flow 2 slm 5 slm
Temperature 1050 oC 1050 oC
Oxidation time 30 min 100 min
QC limits Thickness Non-uniformity (both over a single wafer

and over the boat)

DRY1050 107.3 nm - 113.3 nm 3.2 %
WET1050 298.2 nm - 305.5 nm 3.7 %

Numbers from March 2020


Overview of the performance of the Boron Drive-in and Pre-dep furnace and some process related parameters

Purpose
  • Thermal oxidation of Si wafers
  • Boron pre-deposition/doping of Si wafers
  • Oxidation of boron phase layers
  • Driving-in pre-deposited or ion-implanted boron

Thermal oxidation:

  • Dry oxidation using O2
  • Wet oxidation using H2O vapour

Boron pre-deposition/doping:

  • Boron-nitride wafers are used as doping source. This is a solid doping source containing B2O3

Driving-in pre-deposited or ion-implanted boron

  • Dry or wet oxidation recipes are normally used for this purpose
Performance Film thickness
  • Dry oxide: ~ 0 nm - 300 nm (it takes too long to grow a thicker oxide)
  • Wet oxide: ~ 0 nm - 3 µm (23 hours wet oxidation at 1100 oC for Si[100] wafers)
Process parameter range Process Temperature
  • 800-1150 oC
Process pressure
  • 1 atm (no vacuum)
Gasses on the system
  • N2
  • O2
  • H2 (in a torch, H2 and O2 burns into H2O vapour for wet oxidation)
Substrates Batch size
  • 1-30 100 mm wafers (or 50 mm wafers) per run
Substrate materials allowed
  • Silicon wafers (RCA cleaned)
  • Boron-nitride source wafers for boron pre-deposition/doping
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